Datasheet

Table Of Contents
Appendix
Page 840 of 846 REJ09B0140-0900 Rev. 9.00
Sep 16, 2010
H8S/2215 Group
C. Package Dimensions
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
Priority.
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
1.20
1.20
0.10
0.07
0.4
8
°
1.20
0.15
0.15
0.200.100.00
0.220.170.12
0.220.170.12
15.8 16.0 16.2
L
1
L
Z
E
Z
D
y
x
e
e
c
1
c
D
b
1
b
p
A
H
D
A
2
E
A
1
H
E
0.60.50.4
MaxNomMin
Dimension in Millimeters
Symbol
Reference
14
1.00
16.216.015.8
1.0
14
Index mark
*1
*2
*3
p
E
D
E
D
F
xMy
120
130
31
90
91 60
61
Z
Z
b
H
E
H
D
2
1
1
Detail F
c
A A
L
A
L
Terminal cross section
p
1
1
b
c
b
c
θ
θ
P-TQFP120-14x14-0.40 0.5g
MASS[Typ.]
TFP-120/TFP-120VPTQP0120LA-A
RENESAS CodeJEITA Package Code Previous Code
Figure C.1 TFP-120, TFP-120V Package Dimension