Datasheet

Appendix
Rev.7.00 Dec. 24, 2008 Page 691 of 698
REJ09B0074-0700
C. Package Dimensions
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
priority.
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
Index mark
*1
*2
*3
p
E
D
E
D
yMx
F
100
125
26
76
75
50
51
E H
D
H
b
Z
Z
2
1
1
Detail F
c
AA
L
A
L
Terminal cross section
1
1
p
b
c c
b
H
E
L
e
e
c
1
A
1
D
E
A
2
H
D
A
b
p
b
1
c
x
y
Z
D
Z
E
L
1
Reference
Symbol
Dimension in Millimeters
Min Nom Max
1.0
0.10
0
° 8°
0.4
0.12 0.17 0.22
0.13 0.18 0.23
0.00 0.10 0.20
1.20
13.8 14.0 14.2
1.00
12
0.16
0.15
0.4 0.5 0.6
0.07
14.214.013.8
1.2
12
1.2
θ
θ
P-TQFP100-12x12-0.40 0.4g
MASS[Typ.]
TFP-100G/TFP-100GVPTQP0100LC-A
RENESAS CodeJEITA Package Code Previous Code
Figure C.1 TFP-100G and TFP-100GV Package Dimensions