Users Manual
Table Of Contents
- 45. 12-Bit D/A Converter (R12DAA)
- 46. Temperature Sensor (TEMPSA)
- 47. Comparator B (CMPBa)
- 47.1 Overview
- 47.2 Register Descriptions
- 47.2.1 Comparator B1 Control Register 1 (CPB1CNT1)
- 47.2.2 Comparator B1 Control Register 2 (CPB1CNT2)
- 47.2.3 Comparator B1 Flag Register (CPB1FLG)
- 47.2.4 Comparator B1 Interrupt Control Register (CPB1INT)
- 47.2.5 Comparator B1 Filter Select Register (CPB1F)
- 47.2.6 Comparator B1 Mode Select Register (CPB1MD)
- 47.2.7 Comparator B1 Reference Input Voltage Select Register (CPB1REF)
- 47.2.8 Comparator B1 Output Control Register (CPB1OCR)
- 47.3 Operation
- 47.4 Comparator B2 and Comparator B3 Interrupts
- 47.5 Usage Note
- 48. Data Operation Circuit (DOC)
- 49. RAM
- 50. Flash Memory (FLASH)
- 50.1 Overview
- 50.2 ROM Area and Block Configuration
- 50.3 E2 DataFlash Area and Block Configuration
- 50.4 Register Descriptions
- 50.4.1 E2 DataFlash Control Register (DFLCTL)
- 50.4.2 Flash P/E Mode Entry Register (FENTRYR)
- 50.4.3 Protection Unlock Register (FPR)
- 50.4.4 Protection Unlock Status Register (FPSR)
- 50.4.5 Flash P/E Mode Control Register (FPMCR)
- 50.4.6 Flash Initial Setting Register (FISR)
- 50.4.7 Flash Reset Register (FRESETR)
- 50.4.8 Flash Area Select Register (FASR)
- 50.4.9 Flash Control Register (FCR)
- 50.4.10 Flash Extra Area Control Register (FEXCR)
- 50.4.11 Flash Processing Start Address Register H (FSARH)
- 50.4.12 Flash Processing Start Address Register L (FSARL)
- 50.4.13 Flash Processing End Address Register H (FEARH)
- 50.4.14 Flash Processing End Address Register L (FEARL)
- 50.4.15 Flash Write Buffer Register n (FWBn) (n = 0 to 3)
- 50.4.16 Flash Status Register 0 (FSTATR0)
- 50.4.17 Flash Status Register 1 (FSTATR1)
- 50.4.18 Flash Error Address Monitor Register H (FEAMH)
- 50.4.19 Flash Error Address Monitor Register L (FEAML)
- 50.4.20 Flash Start-Up Setting Monitor Register (FSCMR)
- 50.4.21 Flash Access Window Start Address Monitor Register (FAWSMR)
- 50.4.22 Flash Access Window End Address Monitor Register (FAWEMR)
- 50.4.23 Unique ID Register n (UIDRn) (n = 0 to 3)
- 50.5 Start-Up Program Protection
- 50.6 Area Protection
- 50.7 Programming and Erasure
- 50.8 Boot Mode
- 50.9 Flash Memory Protection
- 50.10 Communication Protocol
- 50.10.1 State Transition in Boot Mode (SCI Interface)
- 50.10.2 Command and Response Configuration
- 50.10.3 Response to Undefined Commands
- 50.10.4 Boot Mode Status Inquiry
- 50.10.5 Inquiry Commands
- 50.10.6 Setting Commands
- 50.10.7 ID Code Authentication Command
- 50.10.8 Program/Erase Commands
- 50.10.9 Read-Check Commands
- 50.11 Serial Programmer Operation in Boot Mode (SCI Interface)
- 50.11.1 Bit Rate Automatic Adjustment Procedure
- 50.11.2 Procedure to Receive the MCU Information
- 50.11.3 Procedure to Select the Device and Change the Bit Rate
- 50.11.4 Procedure for Transition to the Program/Erase Host Command Wait State
- 50.11.5 Procedure to Unlock Boot Mode ID Code Protection
- 50.11.6 Procedure to Erase the User Area and Data Area
- 50.11.7 Procedure to Program the User Area and Data Area
- 50.11.8 Procedure to Check Data in the User Area
- 50.11.9 Procedure to Check Data in the Data Area
- 50.11.10 Procedure to Set the Access Window in the User Area
- 50.12 Rewriting by Self-Programming
- 50.13 Usage Notes
- 50.14 Usage Notes in Boot Mode
- 51. Electrical Characteristics
- 51.1 Absolute Maximum Ratings
- 51.2 DC Characteristics
- 51.3 AC Characteristics
- 51.3.1 Clock Timing
- 51.3.2 Reset Timing
- 51.3.3 Timing of Recovery from Low Power Consumption Modes
- 51.3.4 Control Signal Timing
- 51.3.5 Timing of On-Chip Peripheral Modules
- 51.3.5.1 Timing of I/O Ports
- 51.3.5.2 Timing of MTU/TPU
- 51.3.5.3 Timing of POE
- 51.3.5.4 Timing of TMR
- 51.3.5.5 Timing of SCI
- 51.3.5.6 Timing of RIIC
- 51.3.5.7 Timing of RSPI
- 51.3.5.8 Timing of SSI
- 51.3.5.9 Timing of SDHI
- 51.3.5.10 Timing of A/D Converter Trigger
- 51.3.5.11 Timing of CAC
- 51.3.5.12 Timing of CLKOUT
- 51.3.5.13 Timing of CLKOUT_RF
- 51.4 USB Characteristics
- 51.5 A/D Conversion Characteristics
- 51.6 D/A Conversion Characteristics
- 51.7 Temperature Sensor Characteristics
- 51.8 Comparator Characteristics
- 51.9 CTSU Characteristics
- 51.10 Characteristics of Power-On Reset Circuit and Voltage Detection Circuit
- 51.11 Oscillation Stop Detection Timing
- 51.12 Battery Backup Function Characteristics
- 51.13 ROM (Flash Memory for Code Storage) Characteristics
- 51.14 E2 DataFlash Characteristics (Flash Memory for Data Storage)
- 51.15 BLE Characteristics
- 51.16 Usage Notes
- Appendix 1. Port States in Each Processing Mode
- Appendix 2. Package Dimensions
- REVISION HISTORY
- Colophon
- Address List
- Back cover
R01UH0823EJ0110 Rev.1.10 Page 1602 of 1852
Nov 30, 2020
RX23W Group 44. 12-Bit A/D Converter (S12ADE)
44.3 Operation
44.3.1 Scanning Operation
In scanning, A/D conversion is performed sequentially on the analog inputs of the specified channels.
A scan conversion is performed in three operating modes: single scan mode, continuous scan mode, and group scan
mode. Also, conversion modes are divided into high-speed conversion mode and normal conversion mode. In single scan
mode, one or more specified channels are scanned once. In continuous scan mode, one or more specified channels are
scanned repeatedly until the ADCSR.ADST bit is cleared to 0 from 1 by software. In group scan mode, the selected
channels of group A and the selected channels of group B are scanned once after starting to be scanned according to the
respective synchronous trigger.
In single scan mode and continuous scan mode, A/D conversion is performed for ANn channels selected by the
ADANSA0 and ADANSA1 registers, starting from the channel with the smallest number n. In group scan mode, A/D
conversion is performed for ANn channels of group A and group B selected by the ADANSA0, ADANSA1, ADANSB0,
and ADANSB1 registers, respectively, starting from the channel with the smallest number n.
When self-diagnosis is selected, it is executed once at the beginning of each scan and one of the three voltages internally
generated in the 12-bit A/D converter is converted.
When performing A/D conversion of the temperature sensor output or internal reference voltage, execute scanning
individually.
Double trigger mode is to be used with single scan mode or group scan mode. With double trigger mode being enabled,
A/D conversion data of a channel selected by the ADCSR.DBLANS[4:0] bits is duplicated only if the conversion is
started by the synchronous trigger selected by the ADSTRGR.TRSA[5:0] bits.