Users Manual
Table Of Contents
- 45. 12-Bit D/A Converter (R12DAA)
- 46. Temperature Sensor (TEMPSA)
- 47. Comparator B (CMPBa)
- 47.1 Overview
- 47.2 Register Descriptions
- 47.2.1 Comparator B1 Control Register 1 (CPB1CNT1)
- 47.2.2 Comparator B1 Control Register 2 (CPB1CNT2)
- 47.2.3 Comparator B1 Flag Register (CPB1FLG)
- 47.2.4 Comparator B1 Interrupt Control Register (CPB1INT)
- 47.2.5 Comparator B1 Filter Select Register (CPB1F)
- 47.2.6 Comparator B1 Mode Select Register (CPB1MD)
- 47.2.7 Comparator B1 Reference Input Voltage Select Register (CPB1REF)
- 47.2.8 Comparator B1 Output Control Register (CPB1OCR)
- 47.3 Operation
- 47.4 Comparator B2 and Comparator B3 Interrupts
- 47.5 Usage Note
- 48. Data Operation Circuit (DOC)
- 49. RAM
- 50. Flash Memory (FLASH)
- 50.1 Overview
- 50.2 ROM Area and Block Configuration
- 50.3 E2 DataFlash Area and Block Configuration
- 50.4 Register Descriptions
- 50.4.1 E2 DataFlash Control Register (DFLCTL)
- 50.4.2 Flash P/E Mode Entry Register (FENTRYR)
- 50.4.3 Protection Unlock Register (FPR)
- 50.4.4 Protection Unlock Status Register (FPSR)
- 50.4.5 Flash P/E Mode Control Register (FPMCR)
- 50.4.6 Flash Initial Setting Register (FISR)
- 50.4.7 Flash Reset Register (FRESETR)
- 50.4.8 Flash Area Select Register (FASR)
- 50.4.9 Flash Control Register (FCR)
- 50.4.10 Flash Extra Area Control Register (FEXCR)
- 50.4.11 Flash Processing Start Address Register H (FSARH)
- 50.4.12 Flash Processing Start Address Register L (FSARL)
- 50.4.13 Flash Processing End Address Register H (FEARH)
- 50.4.14 Flash Processing End Address Register L (FEARL)
- 50.4.15 Flash Write Buffer Register n (FWBn) (n = 0 to 3)
- 50.4.16 Flash Status Register 0 (FSTATR0)
- 50.4.17 Flash Status Register 1 (FSTATR1)
- 50.4.18 Flash Error Address Monitor Register H (FEAMH)
- 50.4.19 Flash Error Address Monitor Register L (FEAML)
- 50.4.20 Flash Start-Up Setting Monitor Register (FSCMR)
- 50.4.21 Flash Access Window Start Address Monitor Register (FAWSMR)
- 50.4.22 Flash Access Window End Address Monitor Register (FAWEMR)
- 50.4.23 Unique ID Register n (UIDRn) (n = 0 to 3)
- 50.5 Start-Up Program Protection
- 50.6 Area Protection
- 50.7 Programming and Erasure
- 50.8 Boot Mode
- 50.9 Flash Memory Protection
- 50.10 Communication Protocol
- 50.10.1 State Transition in Boot Mode (SCI Interface)
- 50.10.2 Command and Response Configuration
- 50.10.3 Response to Undefined Commands
- 50.10.4 Boot Mode Status Inquiry
- 50.10.5 Inquiry Commands
- 50.10.6 Setting Commands
- 50.10.7 ID Code Authentication Command
- 50.10.8 Program/Erase Commands
- 50.10.9 Read-Check Commands
- 50.11 Serial Programmer Operation in Boot Mode (SCI Interface)
- 50.11.1 Bit Rate Automatic Adjustment Procedure
- 50.11.2 Procedure to Receive the MCU Information
- 50.11.3 Procedure to Select the Device and Change the Bit Rate
- 50.11.4 Procedure for Transition to the Program/Erase Host Command Wait State
- 50.11.5 Procedure to Unlock Boot Mode ID Code Protection
- 50.11.6 Procedure to Erase the User Area and Data Area
- 50.11.7 Procedure to Program the User Area and Data Area
- 50.11.8 Procedure to Check Data in the User Area
- 50.11.9 Procedure to Check Data in the Data Area
- 50.11.10 Procedure to Set the Access Window in the User Area
- 50.12 Rewriting by Self-Programming
- 50.13 Usage Notes
- 50.14 Usage Notes in Boot Mode
- 51. Electrical Characteristics
- 51.1 Absolute Maximum Ratings
- 51.2 DC Characteristics
- 51.3 AC Characteristics
- 51.3.1 Clock Timing
- 51.3.2 Reset Timing
- 51.3.3 Timing of Recovery from Low Power Consumption Modes
- 51.3.4 Control Signal Timing
- 51.3.5 Timing of On-Chip Peripheral Modules
- 51.3.5.1 Timing of I/O Ports
- 51.3.5.2 Timing of MTU/TPU
- 51.3.5.3 Timing of POE
- 51.3.5.4 Timing of TMR
- 51.3.5.5 Timing of SCI
- 51.3.5.6 Timing of RIIC
- 51.3.5.7 Timing of RSPI
- 51.3.5.8 Timing of SSI
- 51.3.5.9 Timing of SDHI
- 51.3.5.10 Timing of A/D Converter Trigger
- 51.3.5.11 Timing of CAC
- 51.3.5.12 Timing of CLKOUT
- 51.3.5.13 Timing of CLKOUT_RF
- 51.4 USB Characteristics
- 51.5 A/D Conversion Characteristics
- 51.6 D/A Conversion Characteristics
- 51.7 Temperature Sensor Characteristics
- 51.8 Comparator Characteristics
- 51.9 CTSU Characteristics
- 51.10 Characteristics of Power-On Reset Circuit and Voltage Detection Circuit
- 51.11 Oscillation Stop Detection Timing
- 51.12 Battery Backup Function Characteristics
- 51.13 ROM (Flash Memory for Code Storage) Characteristics
- 51.14 E2 DataFlash Characteristics (Flash Memory for Data Storage)
- 51.15 BLE Characteristics
- 51.16 Usage Notes
- Appendix 1. Port States in Each Processing Mode
- Appendix 2. Package Dimensions
- REVISION HISTORY
- Colophon
- Address List
- Back cover
R01UH0823EJ0110 Rev.1.10 Page 1763 of 1852
Nov 30, 2020
RX23W Group 51. Electrical Characteristics
51.2 DC Characteristics
Table 51.3 DC Characteristics (1)
Conditions: 2.7 V ≤ VCC = VCC_USB = VCC_RF = AVCC_RF ≤ 3.6 V, 2.7 V ≤ AVCC0 ≤ 3.6 V,
VSS = AVSS0 = VSS_USB = VSS_RF = 0 V, T
a
= –40 to +85°C
Item Symbol Min. Typ. Max. Unit
Test
Conditions
Schmitt trigger
input voltage
RIIC input pin
(except for SMBus, 5 V tolerant)
V
IH
VCC × 0.7 — 5.8 V
Ports 16, 17, port B5
(5 V tolerant)
VCC × 0.8 — 5.8
Ports 14, 15, ports 21, 22, 25 to 27,
ports 35 to 37,
ports B0, B1, B3, B5, B7,
ports C0, C2 to C7,
ports D3,
ports E0 to E4,
port J3,
Ports 30, 31 (when time capture
event input is not selected), RES#
VCC × 0.8 — VCC + 0.3
Ports 03, 05, 07, ports 40 to 47 AVCC0 × 0.8 — AVCC0 + 0.3
Ports 30, 31
(when time
capture event
input is
selected)
When VCC is
supplied
VCC × 0.8 — VCC + 0.3
When VBATT is
supplied
VBATT × 0.8 — VBATT + 0.3
Ports 03, 05, 07, ports 40 to 47 V
IL
–0.3 — AVCC0 × 0.2
RIIC input pin (except for SMBus) –0.3 — VCC × 0.3
Other than RIIC input pin or ports
30, 31
–0.3 — VCC × 0.2
Ports 30, 31
(when time
capture event
input is
selected)
When VCC is
supplied
–0.3 — VCC × 0.3
When VBATT is
supplied
–0.3 — VBATT × 0.3
Ports 03, 05, 07, ports 40 to 47 ΔV
T
AVCC0 × 0.1 — —
RIIC input pin (except for SMBus) VCC × 0.05 — —
Ports 16, 17, Port B5 VCC × 0.05 — —
Other than RIIC input pin VCC × 0.1 — —
Input level
voltage (except
for Schmitt
trigger input
pins)
MD V
IH
VCC × 0.9 — VCC + 0.3 V
EXTAL (external clock input) VCC × 0.8 — VCC + 0.3
RIIC input pin (SMBus) 2.1 — VCC + 0.3
MD V
IL
–0.3 — VCC × 0.1
EXTAL (external clock input) –0.3 — VCC × 0.2
RIIC input pin (SMBus) –0.3 — 0.8