Quality Beyond Expectations
Table Of Contents
- Slide Number 1
- Contents
- Introduction
- REC Group – A leading, global solar company
- Vertically integrated manufacturing
- REC’s competitive advantage – minimum transport
- Slide Number 7
- Product Qualification and Testing
- International standards
- Certification results above industry standards
- Pushing the standards
- What is REC’s Combined Cycle Test?
- Internal qualification results above IEC standards
- REC goes further - Extended Qualification
- Extended qualification results double IEC Standards
- How does REC carry out its qualification?
- REC’s internal laboratory
- Other signs of quality
- Environmental and Quality Standards
- Slide Number 20
- Ensuring quality in the field
- REC’s test systems
- Proven performance in India
- Proven performance in Singapore
- Proven performance in Europe
- Reliability and Durability Model (RAD)
- Predicting and analysing degradation using models
- Slide Number 28
- Foundations for quality
- RBS and RPDM supporting quality and predictability
- RBS controls quality through all key inputs
- A highly automated manufacturing process
- In-process automated checks
- Slide Number 34
- Third party bankability audits
- Black & Veatch conclusions
- Mott MacDonald conclusions
- Summary of report findings*
- Slide Number 39
- The REC warranty
- REC’s low customer claims level is evidence of quality
- REC takes warranty claims seriously
- Summary
- Slide Number 44
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© 2012 REC All rights reserved. Confidential © 2012 REC All rights reserved. Confidential
In-process automated checks
Infra-red cameras
Inclusions and cracks
Sawmark detection system
Sawmarks can lead to weaker wafers or cause
shunts
Camera systems
Chips & edge defects may lead to breakages in
cell or module lines
Camera systems
Inspect geometry, wafer breakages, cell print
defects
Colour camera system
Thickness of anti-reflection layer
I-V forward and reverse sweep test
Conducted on all cells
Infra-red thermal imager
Inspects all cells for hot-spots in reverse bias
Module
Camera systems
At cell, string, matrix and laminate levels
Cell
Inspect all cells for cracks & chipped edges
String
Inspect all strings for cracks, chipped edges,
spacing & ribbon misalignment
Matrix
Inspect all matrices for cracks, chipped edges,
spacing, contamination, misalignment & polarity
Laminate
Cracks, chips, spacing, misalignment,
contamination, label, backsheet damage,
lamination issues, cell print defects.
Dark IV
Checks for shunt resistance and string polarity
Flash test
IV curve, max power and resistance testing
Hi-pot testing
Electrical insulation and ground continuity
testing for each terminal
Visual inspection x 4
Cracked cells, chips, misalignment,
contamination, labels, backsheet damage,
lamination issues, cell print defects.
Wafer Cell Panel