Data Sheet

Compute Module Datasheet

4 Mechanical Speciﬁcation

The Compute Modules conform to JEDEC MO-224 mechanical speciﬁcation for 200 pin DDR2 (1.8V)

SODIMM modules (with the exception that the CM3, CM3L modules are 31mm in height rather than

30mm of CM1) and therefore should work with the many DDR2 SODIMM sockets available on the

market. (Please note that the pinout of the Compute Module is not the same as a DDR2 SODIMM

module; they are not electrically compatible.)

The SODIMM form factor was chosen as a way to provide the 200 pin connections using a standard,

readily available and low cost connector compatible with low cost PCB manufacture.

The maximum component height on the underside of the Compute Module is 1.2mm.

The maximum component height on the top side of the Compute Module is 1.5mm.

The Compute Module PCB thickness is 1.0mm +/- 0.1mm.

Note that the location and arrangement of components on the Compute Module may change slightly

over time due to revisions for cost and manufacturing considerations; however, maximum component

heights and PCB thickness will be kept as speciﬁed.

Figure 3 gives the CM1 mechanical dimensions. Figure 4 gives the CM3 and CM3L mechanical dimen-

sions.

Figure 3: CM1 Mechanical Dimensions

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