Datasheet

PN512 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 5.2 — 16 June 2016
111352 5 of 137
NXP Semiconductors
PN512
Full NFC Forum-compliant frontend
4. Ordering information
Table 2. Ordering information
Type number Package
Name Description Version
PN5120A0HN1/C2 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads;
32 terminal; body 5  5  0.85 mm
SOT617-1
PN5120A0HN/C2 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6  6  0.85 mm
SOT618-1
PN512AA0HN1/C2 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads;
32 terminal; body 5  5  0.85 mm
SOT617-1
PN512AA0HN1/C2BI HVQFN32 plastic thermal enhanced very thin quad flat package; no leads;
32 terminal; body 5  5  0.85 mm
SOT617-1
PN5120A0HN1/C1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads;
32 terminal; body 5  5  0.85 mm
SOT617-1
PN5120A0HN/C1 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6  6  0.85 mm
SOT618-1
PN5120A0ET/C2 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls SOT1336-1