Datasheet

PN512 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 5.2 — 16 June 2016
111352 125 of 137
NXP Semiconductors
PN512
Full NFC Forum-compliant frontend
Fig 46. Package outline package version (TFBGA64)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1336-1
- - -
sot1336-1_po
12-06-19
12-08-28
Unit
mm
max
nom
min
1.15 0.35 0.45 5.6 5.6
4.55 0.15 0.1
A
Dimensions (mm are the original dimensions)
TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls
A
1
A
2
0.80
1.00 0.30 0.40 5.5 5.5 0.650.70
bDEee
1
4.55
0.90 0.25 0.35 5.4 5.40.65
e
2
vw
0.08
yy
1
0.1
SOT1336-1
C
y
C
y
1
0 5 mm
scale
X
A
A
2
A
1
detail X
ball A1
index area
ball A1
index area
A
E
B
D
e
2
e
A
B
C
D
E
F
G
H
24613578
e
1
e
AC
B
Ø v
CØ w
b
1/2 e
1/2 e