Datasheet

PN512 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 5.2 — 16 June 2016
111352 124 of 137
NXP Semiconductors
PN512
Full NFC Forum-compliant frontend
Fig 45. Package outline package version (HVQFN40)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT618-1
MO-220
sot618-1_po
02-10-22
13-11-05
Unit
mm
max
nom
min
1.00 0.05 0.2 6.1 4.25 6.1
0.4
A
(1)
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6 x 6 x 0.85 mm
SOT618-1
A
1
b
0.30
cD
(1)
D
h
E
(1)
E
h
4.10
ee
1
e
2
Lvw
0.05
y
0.05
y
1
0.1
0.85 0.02 6.0 4.10 6.00.21
0.33.950.80 0.00 5.9 3.95 5.90.18
0.5 4.5 0.54.25 4.5 0.1
e
e
1/2 e
1/2 e
y
terminal 1
index area
A
A
1
c
L
E
h
D
h
b
11 20
40 31
30
21
10
1
D
E
terminal 1
index area
0 2.5 5 mm
scale
e
1
AC
C
B
v
w
C
y
1
C
e
2
X
detail X
B
A