Instruction Manual

Preliminary W24L257
- 8 -
BONDING PAD DIAGRAM
23
X
Y
A14
A12
A7
A6
A5
A3
8
22
A2
A10
OEB
A11A9
A8
WEB
V
DD
V
DD
7
A4
A13
1
2
3
4
529
242526
27
6
30
28
11 12
13
15 16 17 18
A0
I/O0 I/O1
I/O2
V
SS
V
SS
I/O4 I/O5
I/O6
19
9
A1
10 20
CSB
14
21
I/O7I/O3
AC5394
PAD NO. X Y
1 -232.25 1445.22
2 -351.70 1445.22
3 -471.15 1445.22
4 -590.60 1445.22
5 -710.05 1445.22
6 -829.50 1445.22
7 -992.79 1362.24
8 -992.79 -1306.11
9 -857.86 -1452.79
10 -738.41 -1452.79
11 -594.84 -1414.13
12 -451.06 -1414.13
13 -310.67 -1414.13
14 -171.78 -1405.28
15 24.45 -1405.28
16 151.80 -1414.13
17 298.07 -1414.13
18 443.28 -1414.13
19 588.20 -1414.13
20 732.84 -1414.13
21 871.11 -1452.79
22 992.75 -1312.15
23 992.75 1373.67
24 810.09 1445.22
25 690.64 1445.22
26 571.19 1445.22
27 451.74 1445.22
28 332.29 1445.22
29 120.25 1444.65
30 -93.23 1444.65
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.