Owner manual

W24257
- 8 -
BONDING PAD DIAGRAM
12
3
4
5
8
11
12 13
15 16
17
18
20
22
23
242526
27
21
X
Y
A14A12A7
A6
A5
A3
A2
A0 I/O1 I/O2 I/O3
V
SS
V
SS
I/O5
I/O6
I/O7
19
CS
A10
OE
A11
A9
A8WEV
DDV
DD
6
7
9
A1
10
A4 A13
28
S-2
28
S-1
14
S-1
14
S-2
I/O4
I/O8
PAD NO. X Y
1 -127.08 2785.05
2 -377.73 2785.05
3 -628.38 2785.05
4 -879.03 2785.05
5 -1129.68 2785.05
6 -1380.33 2785.05
7 -1686.51 2640.06
8 -1682.01 -2645.91
9 -1448.10 -2802.51
10 -1090.80 -2802.51
11 -877.32 -2807.28
12 -627.84 -2807.28
13 -349.56 -2807.28
14S-1 -155.52 -2781.00
14S-2 -7.02 -2771.64
15 249.21 -2807.28
16 498.69 -2807.28
17 776.97 -2807.28
18 1026.45 -2807.28
19 1304.73 -2807.28
20 1689.30 -2802.51
21 1686.51 -2520.90
22 1686.51 2644.74
23 1459.17 2785.05
24 1208.52 2785.05
25 957.87 2785.05
26 707.22 2785.05
27 456.57 2785.05
28S-1 205.92 2771.55
28S-2 21.42 2780.91
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.