Manual

�� Maxim Integrated Products 12

MAX98314

Mono 3.2W Class D Amplifier

with Integrated Input Coupling Capacitors

Ordering Information

WLP Applications Information

For the latest application details on WLP construction,

dimensions, tape carrier information, PCB techniques,

bump-pad layout, and recommended reflow temperature

profile, as well as the latest information on reliability test-

ing results, refer to Application Note 1891: Wafer-Level

Packaging (WLP) and Its Applications. Figure 3 shows

the dimensions of the WLP balls used on the IC.

Figure 3. WLP Ball Dimensions

+Denotes a lead(Pb)-free/RoHS-compliant package.

PART TEMP RANGE PIN-PACKAGE

MAX98314EWL+

-40NC to +85NC

9 WLP

0.18mm