Instruction Manual

UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to the application note,
“UCSP—A Wafer-Level Chip-Scale Package” available
on Maxim’s web site at http://www.maxim-ic.com/ucsp.
UCSP Marking Information
Pin A1 Bump Indicator
AAA: Product ID code
XXX: Lot Code
Chip Information
TRANSISTOR COUNT: 4877
PROCESS: BiCMOS
MAX9716/MAX9717
Low-Cost, Mono, 1.4W BTL Audio Power
Amplifiers
______________________________________________________________________________________ 13
Selector Guide
PART BTL/SE INPUT GAIN (dB)
MAX9716 — Adjustable
MAX9717A √ Adjustable
MAX9717B √ 6
MAX9717C √ 9
MAX9717D √ 12
Ordering Information (continued)
PART
TEMP RANGE
PIN-
PACKAGE
GAIN
(dB)
MAX9717AEBL-T*
-40°C to +85°C
3 x 3 UCSP
Adj.
MAX9717AETA
-40°C to +85°C 8 TDFN-EP**
Adj.
MAX9717AEUA
-40°C to +85°C 8 µMAX-EP**
Adj.
MAX9717BEBL-T*
-40°C to +85°C
3 x 3 UCSP 6
MAX9717BETA
-40°C to +85°C 8 TDFN-EP**
6
MAX9717BEUA
-40°C to +85°C 8 µMAX-EP**
6
MAX9717CEBL-T*
-40°C to +85°C
3 x 3 UCSP 9
MAX9717CETA
-40°C to +85°C 8 TDFN-EP**
9
MAX9717CEUA
-40°C to +85°C 8 µMAX-EP**
9
MAX9717DEBL-T*
-40°C to +85°C
3 x 3 UCSP 12
MAX9717DETA
-40°C to +85°C 8 TDFN-EP**
12
MAX9717DEUA
-40°C to +85°C 8 µMAX-EP**
12
AAA
XXX
*Future product—contact factory for availability.
**EP = Exposed paddle.