Owner manual

Exposed Pads
The TSSOP-EP package has an exposed pad on the
bottom of the package. This pad is electrically connect-
ed to GND and should be connected to the ground
plane for improved thermal conductivity. Do not route
signals under this package.
Chip Information
TRANSISTOR COUNT: 6300
PROCESS: BiCMOS
MAX7445
4-Channel Video Reconstruction Filter
_______________________________________________________________________________________ 7
14
13
12
11
10
9
8
1
2
3
4
5
6
7
OUTA
OUTB
OUTC
OUTDIND
INC
INB
INA
TOP VIEW
MAX7445
V
CC
SELECT
GNDGAIN
GND
DISABLE
TSSOP
Pin Configuration