User guide

MAX4249–MAX4257
UCSP, Single-Supply, Low-Noise,
Low-Distortion, Rail-to-Rail Op Amps
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
DD
= 5V, V
SS
= 0, V
CM
= 0, V
OUT
= V
DD
/2, R
L
tied to V
DD
/2, SHDN = V
DD
, T
A
= -40°C to +85°C, unless otherwise noted. Typical
values are at T
A
= +25°C.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Power-Supply Voltage (V
DD
to V
SS
) ......................+6.0V to -0.3V
Analog Input Voltage (IN_+, IN_-)....(V
DD
+ 0.3V) to (V
SS
- 0.3V)
SHDN Input Voltage ......................................6.0V to (V
SS
- 0.3V)
Output Short-Circuit Duration to Either Supply ..........Continuous
Continuous Power Dissipation (T
A
= +70°C)
5-Pin SOT23 (derate 7.1mW/°C above +70°C)...........571mW
8-Pin µMAX (derate 4.5mW/°C above +70°C) ............362mW
8-Pin SO (derate 5.88mW/°C above +70°C)...............471mW
8-Pin UCSP (derate 4.7mW/°C above +70°C) ............379mW
10-Pin UCSP (derate 6.1mW/°C above +70°C) ...........484mW
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
14-Pin SO (derate 8.33mW/°C above +70°C)..............667mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) ................................................................+220°C
Vapor Phase (60s) ........................................................+215°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range V
DD
(Note 4) 2.4 5.5 V
V
DD
= 3V 400
V
DD
= 5V 420 575Normal mode
V
DD
= 5V, UCSP only 420 655
Quiescent Supply Current Per
Amplifier
I
Q
Shutdown mode (SHDN = V
SS
) (Note 2) 0.5 1.5
µA
Input Offset Voltage (Note 5) V
OS
±0.07 ±0.75 mV
Input Offset Voltage Tempco TCV
OS
0.3 µV/°C
Input Bias Current I
B
(Note 6) ±1 ±100 pA
Input Offset Current I
OS
(Note 6) ±1 ±100 pA
Differential Input Resistance R
IN
1000 GΩ
Input Common-Mode Voltage
Range
V
CM
Guaranteed by CMRR test -0.2 V
DD
- 1.1 V
Common-Mode Rejection Ratio CMRR V
SS
- 0.2V ≤ V
CM
≤ V
DD
- 1.1V 70 115 dB
Power-Supply Rejection Ratio PSRR V
DD
= 2.4 to 5.5V 75 100 dB
R
L
= 10kΩ to V
DD
/2;
V
OUT
= 25mV to V
DD
- 4.97V
80 116
Large-Signal Voltage Gain A
V
R
L
= 1kΩ to V
DD
/2;
V
OUT
= 150V to V
DD
- 4.75V
80 112
dB
V
DD
- V
OH
825
Output Voltage Swing V
OUT
|V
IN+
- V
IN-
| ≥ 10mV
R
L
= 10kΩ to V
DD
/2
V
OL
- V
SS
720
mV
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles rec-
ommended in the industry-standard specification, JEDEC 020A, paragrah 7.6, Table 3 for IR/VPR and Convection Reflow.
Preheating is required. Hand or wave soldering is not allowed.