Owner manual

MAX19996
SiGe High-Linearity, 2000MHz to 3000MHz
Downconversion Mixer with LO Buffer
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
CC
= +3.0V to +3.6V, no input AC signals. T
C
= -40°C to +85°C, unless otherwise noted. Typical values
are at V
CC
= +3.3V, T
C
= +25°C, parameters are guaranteed by design and not production tested, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND...........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, LO, IFBIAS,
LEXT to GND ..........................................-0.3V to (V
CC
+ 0.3V)
RF, LO Input Power ........................................................+12dBm
RF, LO Current
(RF and LO is DC shorted to GND through a balun) ......50mA
Continuous Power Dissipation (Note 1) ..............................5.0W
θ
JA
(Notes 2, 3)..............................................................+38°C/W
θ
JC
(Notes 1, 3)................................................................13°C/W
Operating Case Temperature
Range (Note 4)........................................T
C
= -40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
3.0 3.3 3.6 V
Supply Current I
CC
Total supply current, V
CC
= +3.3V 149.5 mA
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
CC
= +4.75V to +5.25V, no input AC signals. T
C
= -40°C to +85°C, unless otherwise noted. Typical val-
ues are at V
CC
= +5.0V, T
C
= +25°C, all parameters are production tested.) (Note 6)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.75 5 5.25 V
Supply Current I
CC
230 245 mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency f
RF
(Note 7) 2000 3000 MHz
LO Frequency f
LO
(Note 7) 1800 2550 MHz
U si ng M i ni - C i r cui ts TC 4- 1W- 17 4:1 tr ansfor m er
as d efi ned i n the Typ i cal Ap p l i cati on C i r cui t, IF
m atchi ng com p onents affect the IF fr eq uency
r ang e ( N ote 7)
100 500
IF Frequency f
IF
U si ng al ter nati ve M i ni - C i r cui ts TC 4- 1W- 7A
4:1 transformer, IF matching components
affect the IF frequency range (Note 7)
50 250
MHz
LO Drive Level P
LO
-3 +3 dBm
Note 1: Based on junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
Note 4: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.