Manual

19
ATA6830
4575B–BCD–01/03
7.2
Delay time 2 following
commands
22 T
D
5msC, D
7.3
Pause time Between high and low
byte
22 T
P
0µsC, D
7.4 Clamping time Bus error clamping 22 Tcl 3 s C, D
8Logic
8.1
Reference run
detection
Commands in series
to execute first
reference run
Ref3333cmd
(1)
D
8.2
Synchronization 15% oscillator
tolerance
Sync 4 cmd
(1)
D
9 Thermal Values
9.1 Thermal prewarning T_150 150 °CB
9.2 Hysteresis Thermal prewarning T_150
HYS
10 °CB
9.3 Thermal shut down T_160 160 °CB
9.5
Thermal current
boost
T_0 0 °CB
9.6
Hysteresis Thermal currrent
boost
T_0_HYS 10 °CB
Electrical Characteristics (Continued)
No. Parameters Test Conditions
Pin
Symbol Min. Typ. Max. Unit Type*
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note: 1. cmd = command
Soldering Recommendations
Parameters Symbol Value Unit
Maximum heating rate T
D
1 to 3 °C/s
Peak temperature in preheat zone T
PH
100 to 140 °C
Duration of time above melting point of solder t
MP
minimum 10
maximum 75
s
Peak reflow temperature T
Peak
220 to 225 °C
Maximum cooling rate T
Peak
2 to 4 °C/s