Manual

10
9146E–AUTO–03/11
Atmel ATA6663/ATA6664
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters Symbol Min. Typ. Max. Unit
V
S
- Continuous supply voltage
–0.3 +40 V
Wake DC and transient voltage (with 2.7kΩ serial resistor)
- Transient voltage according to ISO7637 (coupling 1nF)
–3
–150
+40
+100
V
V
Logic pins (RXD, TXD, EN) –0.3 +5.5 V
LIN
- DC voltage
- Transient voltage according to ISO7637 (coupling 1nF)
–27
–150
+40
+100
V
V
INH
- DC voltage –0.3 V
S
+ 0.3 V
ESD according to IBEE LIN EMC
Test specification 1.0 according to IEC 61000-4-2
- Pin VS, LIN to GND
- Pin WAKE (2.7kΩ serial resistor)
±8
±6
KV
KV
ESD HBM according to STM5.1
with 1.5kΩ / 100pF
- Pin VS, LIN, WAKE, INH to GND
±6 KV
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
±3 KV
CDM ESD STM 5.3.1 ±750 V
Machine Model ESD AEC-Q100-Rev.F (003) ±200 V
Junction temperature T
j
–40 +150 °C
Storage temperature T
stg
–55 +150 °C
5. Thermal Characteristics
Parameters Symbol Min. Typ. Max. Unit
Thermal resistance junction ambient R
thJA
145 K/W
Special heat sink at GND (pin 5) on PCB (fused lead
frame to pin 5)
R
thJA
80 K/W
Thermal shutdown T
off
150 165 180 °C
Thermal shutdown hysteresis T
hys
5 1020°C