Manual
Table Of Contents
- Features
- Pin Configurations
- Description
- Architectural Overview- General Purpose Register File
- ALU – Arithmetic Logic Unit
- In-System Programmable Flash Program Memory
- SRAM Data Memory
- Program and Data Addressing Modes- Register Direct, Single Register Rd
- Register Direct, Two Registers Rd and Rr
- I/O Direct
- Data Direct
- Data Indirect with Displacement
- Data Indirect
- Data Indirect with Pre- decrement
- Data Indirect with Post- increment
- Constant Addressing Using the LPM Instruction
- Indirect Program Addressing, IJMP and ICALL
- Relative Program Addressing, RJMP and RCALL
 
- EEPROM Data Memory
- Memory Access Times and Instruction Execution Timing
- I/O Memory
- Reset and Interrupt Handling- Reset Sources
- Power-on Reset
- External Reset
- Brown-out Detection
- Watchdog Reset
- MCU Status Register – MCUSR
- Interrupt Handling
- General Interrupt Mask Register – GIMSK
- General Interrupt Flag Register – GIFR
- Timer/Counter Interrupt Mask Register – TIMSK
- Timer/Counter Interrupt Flag Register – TIFR
- External Interrupts
- Interrupt Response Time
- MCU Control Register – MCUCR
 
- Sleep Modes
 
- Timer/Counters
- 16-bit Timer/Counter1
- Watchdog Timer
- EEPROM Read/Write Access
- Serial Peripheral Interface – SPI
- UART
- Analog Comparator
- Analog-to-Digital Converter
- I/O Ports
- Memory Programming
- Electrical Characteristics
- External Clock Drive Waveforms
- Typical Characteristics
- Register Summary
- Instruction Set Summary
- Ordering Information
- Packaging Information
- Errata for AT90S/LS4433 Rev. Rev. C/D/E/F
- Data Sheet ChangeLog for AT90S/LS4433
- Table of Contents

98
AT90S/LS4433
1042G–AVR–09/02
Electrical Characteristics
Absolute Maximum Ratings*
Operating Temperature.................................. -55°Cto+125°C
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65°Cto+150°C
Voltage on Any Pin except RESET
with Respect to Ground .............................-1.0V to V
CC
+0.5V
Voltage on RESET
with Respect to Ground ....-1.0V to +13.0V
Maximum Operating Voltage ............................................ 6.6V
DC Current per I/O Pin ............................................... 40.0 mA
DC Current VCC and GND Pins ............................... 300.0 mA
DC Characteristics
T
A
=-40°Cto85°C, V
CC
= 2.7V to 6.0V (unless otherwise noted)
Symbol Parameter Condition Min Typ Max Units
V
IL
Input Low Voltage Except (XTAL, RESET)-0.5 0.3V
CC
(1)
V
V
IL1
Input Low Voltage
XTAL
-0.5 0.2 V
CC
(1)
V
RESET
V
IH
Input High Voltage Except (XTAL, RESET)0.7V
CC
(2)
V
CC
+0.5 V
V
IH1
Input High Voltage XTAL 0.7 V
CC
(2)
V
CC
+0.5 V
V
IH2
Input High Voltage RESET 0.85 V
CC
(2)
V
CC
+0.5 V
V
OL
Output Low Voltage
(3)
(Ports B, C, D)
I
OL
=20mA,V
CC
=5V
I
OL
=10mA,V
CC
=3V
0.6
0.5
V
V
OH
Output High Voltage
(4)
(Ports B, C, D)
I
OH
=-3mA,V
CC
=5V
I
OH
=-1.5mA,V
CC
=3V
4.3
2.2
V
I
IL
Input Leakage
Current I/O pin
V
CC
=6V,pin=low
(absolute value)
8.0 µA
I
IH
Input Leakage
Current I/O pin
V
CC
= 6V, pin = high
(absolute value)
8.0 µA
RRST Reset Pull-up 100.0 500.0 kΩ
R
I/O
I/O Pin Pull-up Resistor 35.0 120.0 kΩ
I
CC
Power Supply Current
Active4MHz,V
CC
=3V 5.0 mA
Idle 4 MHz, V
CC
=3V 2.0 mA
Power-down, V
CC
=3V
WDT enabled
(5)
20.0 µA
Power-down, V
CC
=3V
WDT disabled
(5)
10.0 µA










