Manual

24 13.56 MHz Type B RF Reader
8547A−RFID−10/08
10. Mechanical
10.1. Thermal Characteristics
The AT88RF1354 QFN package thermal characteristics were modeled and characterized by Amkor with JEDEC
standard methods using a multilayer JEDEC test board with nine thermal vias on the PCB thermal pad. ψ
JB
is 12.1
°C/W and θ
JA
is 30.9 °C/W for this package.
Since
ψ
JB
measures the heat transfer between the QFN package and the PC board, it is more relevant than θ
JA
. θ
JA
measures heat transfer between the QFN and stagnant air.
10.2. Moisture Sensitivity
The AT88RF1354 QFN package is qualified to JEDEC level 1.
10.3. Composition
The AT88RF1354 QFN package is a lead-free and halogen-free green package.