Owner manual

43
3638K–DFLASH–11/2012
AT45DB021D
21. Ordering Information
21.1 Ordering Code Detail
21.2 Green Package Options (Pb/Halide-free/RoHS Compliant)
Notes: 1. The shipping carrier option is not marked on the devices
2. Standard parts are shipped with the page size set to 264-bytes. The user is able to configure these parts to a 256-
byte page size if desired
3. Parts ordered with suffix SL954 are shipped in bulk with the page size set to 256-bytes. Parts will have a 954 or
SL954 marked on them
4. Parts ordered with suffix SL955 are shipped in tape and reel with the page size set to 256-bytes. Parts will have a
954 or SL954 marked on them
A T 4 5 D 0 2 S S H B1D– –B
Designator
Product Family
Device Density
02 = 2-megabit
Interface
1 = Serial
Package Option
M = 8-lead, 6 x 5 x 0.6mm UDFN
SS = 8-lead, 0.150" wide SOIC
S = 8-lead, 0.209" wide SOIC
Device Grade
H = NiPdAu lead finish, industrial
temperature range (-40°C to +85°C)
Shipping Carrier Option
B = Bulk (tubes)
Y = Trays
T = Tape and reel
D
e
vi
ce
R
e
vi
s
i
o
n
Ordering Code
(1)(2)
Package Lead Finish Operating Voltage f
SCK
(MHz) Operation Range
AT45DB021D-MH-Y
AT45DB021D-MH-T
AT45DB021D-MH-SL954
(3)
AT45DB021D-MH-SL955
(4)
8MA1
NiPdAu 2.7V to 3.6V 66
Industrial
(-40°C to +85°C)
AT45DB021D-SSH-B
AT45DB021D-SSH-T
AT45DB021D-SSH-SL954
(3)
AT45DB021D-SSH-SL955
(4)
8S1
AT45DB021D-SH-B
AT45DB021D-SH-T
AT45DB021D-SH-SL954
(3)
AT45DB021D-SH-SL955
(4)
8S2
Package Type
8MA1 8-lead(6x5x0.6mmBody), Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.209” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)