User guide

AT28C256
14
Notes: 1. Electrical specifications for these speeds are defined by Standard Microcircuit Drawing 5962-88525.
2. See “Valid Part Numbers” table below.
3. SMD specifies Software Data Protection feature for device type, although Atmel product supplied to every device type in the
SMD is 100% tested for this feature.
250 50 0.35 5962-88525 05 UX
5962-88525 05 XX
5962-88525 05 YX
5962-88525 05 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
5962-88525 03 UX
5962-88525 03 XX
5962-88525 03 YX
5962-88525 03 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
300 50 0.35 5962-88525 10 UX
5962-88525 10 XX
5962-88525 10 YX
5962-88525 10 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
50 0.35 5962-88525 02 UX
5962-88525 02 XX
5962-88525 02 YX
5962-88525 02 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
350 50 0.35 5962-88525 09 UX
5962-88525 09 XX
5962-88525 09 YX
5962-88525 09 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
50 0.35 5962-88525 01 UX
5962-88525 01 XX
5962-88525 01 YX
5962-88525 01 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Ordering Information
(2)
t
ACC
(ns)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
Package Type
28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32L 32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28U 28-pin, Ceramic Pin Grid Array (PGA)
W Die
Options
Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E High Endurance Option: Endurance = 100K Write Cycles
F Fast Write Option: Write Time = 3 ms