User guide

AT28C256
11
Ordering Information
(2)
t
ACC
(ns)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
150 50 0.2 AT28C256(E,F)-15JC
AT28C256(E,F)-15PC
AT28C256(E,F)-15SC
AT28C256(E,F)-15TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
AT28C256(E,F)-15JI
AT28C256(E,F)-15PI
AT28C256(E,F)-15SI
AT28C256(E,F)-15TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
50 0.3 AT28C256(E,F)-15DM/883
AT28C256(E,F)-15FM/883
AT28C256(E,F)-15LM/883
AT28C256(E,F)-15UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
200 50 0.2 AT28C256(E,F)-20JC
AT28C256(E,F)-20PC
AT28C256(E,F)-20SC
AT28C256(E,F)-20TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
AT28C256(E,F)-20JI
AT28C256(E,F)-20PI
AT28C256(E,F)-20SI
AT28C256(E,F)-20TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
50 0.3 AT28C256(E,F)-20DM/883
AT28C256(E,F)-20FM/883
AT28C256(E,F)-20LM/883
AT28C256(E,F)-20UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Package Type
28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)
32L 32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28P6 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28S 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
28T 28-lead, Plastic Thin Small Outline Package (TSOP)
28U 28-pin, Ceramic Pin Grid Array (PGA)
W Die
Options
Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E High Endurance Option: Endurance = 100K Write Cycles
F Fast Write Option: Write Time = 3 ms