User guide

56
AT25DL161 [DATASHEET]
8795E–DFLASH–12/2012
17.3 8U-4 — 8-ball WLCSP
DRAWING NO. REV.
GPC
TITLE
8U-4 B
3/22/12
GFB
8U-4, 8-ball,
(4x2 Array) Wafer Level Chip Scale Package
(WLCSP)
( UNIT OF MEASUREMENT - mm)
BALL COORDINANCE TABULATION
Top View
Side View
Bottom
View
A
j
n
0.015
m
C
j
n
0.050
m
CAB
B
C
D
21
PIN A1
-A-
-B-
d
0.015 4X
0.500
1.887 MAX
3.038 MAX
1.500
0.500
PIN A1
CORNER
0.409 MAX
d
0.075
-C-
0.200±0.025
0.140 MIN
Ø0.290±0.0300
Ball Signal x-coord y-coord
A2 CSBPAD -0.250 0.750
A1 vdd! 0.250 0.750
B2 SOPAD -0.250 0.250
B1 HLDBPAD 0.250 0.250
C2 WPBPAD -0.250 -0.250
C1 SCKPAD 0.250 -0.250
D2 gnd! -0.250 -0.750
D1 SIPAD 0.250 -0.750
2
1. Dimension of ball is measured at the maximum ball diameter
in a plane parallet to the seating plane.
2. Planarity applied to whole wafer.
Package Drawing Contact:
[e-mail]