Manual

18
AT24C1024B [Preliminary]
5194D–SEEPR–5/07
8U4-1 - dBGA2
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
PO8U4-1 A
1/5/05
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
8U4-1, 8-ball, 2.47 x 4.07 mm Body, 0.75 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
A 0.81 0.91 1.00
A
1 0.15 0.20 0.25
A
2 0.40 0.45 0.50
b 0.25 0.30 0.35
D 2.47 BSC
E 4.07 BSC
e 0.75 BSC
e1 0.74 REF
d 0.75 BSC
d1 0.80 REF
5. Dimension 'b' is measured at the maximum solder ball diameter.
This drawing is for general information only.
d
A
SIDE VIEW
TOP VIEW
8 SOLDER BALLS
BOTTOM VIEW
1
A
B
C
D
2
(e1)
e
A1 BALL PAD CORNER
(d1)
5. b
A1
A2
D
A1 BALL PAD CORNER
E