Manual

14
AT17LV65/128/256/512/010/002/040
2321D–CNFG–10/02
Notes: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
Thermal Resistance Coefficients
(1)
Package Type
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010 AT17LV002 AT17LV040
8CN4 Leadless Array Package (LAP)
q
JC
[°C/W] 45 45 45 –
q
JA
[°C/W]
(2)
115.71 135.71 159.60 –
8P3 Plastic Dual Inline Package (PDIP)
q
JC
[°C/W] 37 37 – –
q
JA
[°C/W]
(2)
107 107 – –
8S1
Plastic Gull Wing Small Outline
(SOIC)
q
JC
[°C/W]45–––
q
JA
[°C/W]
(2)
150 – – –
20J
Plastic Leaded Chip Carrier
(PLCC)
q
JC
[°C/W] 35 35 35 –
q
JA
[°C/W]
(2)
90 90 90 –
20S2
Plastic Gull Wing Small Outline
(SOIC)
q
JC
[°C/W] –
q
JA
[°C/W]
(2)
–
44A
Thin Plastic Quad Flat Package
(TQFP)
q
JC
[°C/W] – – 17 17
q
JA
[°C/W]
(2)
– – 62 62
44J
Plastic Leaded Chip Carrier
(PLCC)
q
JC
[°C/W] – – 15 15
q
JA
[°C/W]
(2)
– – 50 50