Instruction Manual
Table Of Contents
- Features
- Description
- Pin Configuration
- Block Diagram
- Device Description
- Pin Description
- FPGA Master Serial Mode Summary
- Control of Configuration
- Cascading Serial Configuration Devices
- Programming Mode
- Standby Mode
- Absolute Maximum Ratings*
- Operating Conditions
- DC Characteristics
- AC Characteristics
- AC Characteristics when Cascading
- AC Characteristics
- Thermal Resistance Coefficients(1)
- Ordering Information
- Packaging Information
16
AT17F040/080
3039C–CNFG–11/02
44A – TQFP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
B
44A
10/5/2001
PIN 1 IDENTIFIER
0˚~7˚
PIN 1
L
C
A1
A2 A
D1
D
e
E1 E
B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 11.75 12.00 12.25
D1 9.90 10.00 10.10 Note 2
E 11.75 12.00 12.25
E1 9.90 10.00 10.10 Note 2
B 0.30 – 0.45
C 0.09 – 0.20
L 0.45 – 0.75
e 0.80 TYP