Owner manual

INTEGRATED CIRCUITS INC.- APR9301
http://www.aplusinc.com.tw Page / 10 VER2.1
7
Table 4 Analog Characteristics ( Note 1 )
Item Symbol Condition Mim Typ Max Unit
MicIn Input Voltage VMI -- -- -- 20 mVp-p
MicIn Input Resistance RMI -- -- 10 --
kΩ
MicIn Amp Gain (1) GMIl
AGC≦2.2V
-- 24 -- dB
MicIn Amp Gain (2) GMI2
AGC≧3.OV
-- -45 -15 dB
AnaIn Input Voltage VANI -- -- -- 50 mVp-p
AnaIn Input Resistance RANI -- -- 10 --
kΩ
AnaIn Amp Gain GANI Analn to SP+/- -- 22 -- dB
AGC Output Resistance RAGC -- -- 1 --
kΩ
SP+/- Output Power Psp
Rsp+/- = 16Ω
-- 12.2 -- mW
Voltage Amplitude Across SP+/- Vsp
Rsp+/-≧16Ω
-- 1.25 -- Vp-p
Total Harmonic Distortion THD
@ 1kHz & 20mVp-p input
1 %
Note 1: Typical Values: VCCD = VCCA = 5V; VSSD = VSSA = 0V; TA = 25℃
Note 2: Except pins 23 and 27 which have internal pull-up resistors.
Bonding Pad Diagram & Description of Bonding Pad Coordinates :
Figure 5 APR9301 Die Bonding Pad Diagram
Notes:
Die diagram is with
respect to die center(um)
Die Dimensions:
X=214± 1 mils(5500um)
Y=144± 1 mils(3750um)
Die Thickness:
13.8± 1.0 mils
(350± 25um)
Pad Opening:
4.3mils
110um
* Connect substrate
to Ground.