Owner's manual

Preliminary
APR6016 Data Sheet
Voice Recording & Playback Device Page 22
Revision 1.0
Figure 18 Bond Pad Layout and Coordinates
10 /RESET
11 VSSA
12 VSSA
13 VSSA
14 AUDOUT
15 SQLCAP
16 /SQLOUT
17 ANAIN-
18 ANAIN+
19 VCCA
20 VCCA
2
1
N
C
2
2
/
B
U
S
Y
9
A
N
A
O
U
T+
8
A
N
A
O
U
T
-
NC 27
NC 28
V
S
S
A
2
3
V
S
S
A
2
4
V
S
S
A
2
5
S
A
C
2
6
/INT 29
EXTCLK 30
VCCD 31
VCCD 32
N
C
7
N
C
6
VSSD 5
VSSD 4
/CS 1
DI 2
DO 3
VCCD 33
Ori
g
in
Table 7 Coordinate Information
DIE SIZE 8230
µ
x 4360
µ
PAD SIZE:100
µ
x 100
µ
DIE THICKNESS: Approximatel
y
25 mils
NOTE:
1. Substrate should be connected to GND.
2. Coordinates
g
iven in Table 7 are for pad centers.
Pad
Number Pad Name
X
Coordinate
Y
Coordinate
1 /CS 8008 1460
2 DI 8008 1173
3 DO 8008 865
4 VSSD 8008 620
5 VSSD 8008 393
6 NC 7654 119
7 NC 7271 119
8 ANAOUT- 570 119
9 ANAOUT+ 299 119
10 /RESET 119 384
11 VSSA 119 665
12 VSSA 119 837
13 VSSA 119 1124
14 AUDOUT 119 1454
15 SQLCAP 119 1894
16 /SQLOUT 119 2528
17 ANAIN- 119 2805
18 ANAIN+ 119 3076
19 VDDA 119 3407
20 VDDA 119 3637
21 NC 258 4116
22 /BUSY 558 4116
23 VSSA 7172 4116
24 VSSA 7345 4116
25 VSSA 7517 4116
26 SAC 7765 4116
27 NC 8008 3806
28 NC 8008 3506
29 /INT 8008 3114
30 EXTCLK 8008 2808
31 VCCD 8008 2433
32 VCCD 8008 2200
33 VCCD 8008 2029
34 SCLK 8008 1802
Pad
Number Pad Name
X
Coordinate
Y
Coordinate
0
0
X Coordinate
Y Coordinate
SCLK 34