User guide

APR6008
Page 21 Voice Recording & Playback Device
Figure 18 Bond Pad Layout and Coordinates
Table 7 Coordinate Information
Pad
Number
Pad
Name
X
Coordinate
Y
Coordinate
1 NC 5149 2069
2 /CS 5149 1622
3 DI 5149 1243
4 DO 5149 901
5 VSSD 5149 610
6 VSSD 5149 383
7 NC 4795 108
8 NC 4412 108
9 ANAOUT- 560 108
10 ANAOUT+ 108 288
11 /RESET 373 108
12 VSSA 108 655
13 VSSA 108 827
14 VSSA 108 1113
15 AUDOUT 108 1426
16 SQLCAP 108 1834
17 /SQLOUT 108 2518
18 ANAIN- 108 2795
19 ANAIN+ 108 3066
20 VCCA 108 3397
21 VCCA 108 3627
Pad
Number
Pad
Name
X
Coordinate
Y
Coordinate
22 NC 248 4106
23 /BUSY 548 4106
24 VSSA 4314 4106
25 VSSA 4486 4106
26 VSSA 4658 4106
27 SAC 4906 4106
28 /INT 5149 3777
29 EXTCLK 5149 3478
30 VCCD 5149 2992
31 VCCD 5149 2760
32 VCCD 5149 2588
33 SCLK 5149 2362
DIE SIZE : 4340µm x 5380µm
PAD SIZE : 100µm x 100µm
DIE THICKNESS : Approximately 25 mils
9
ANAOUT
-
10
ANAOUT+
11 /
RESET
12 VSSA
13 VSSA
14 VSSA
15 AUDOUT
16 SQLCAP
17 /SQLOUT
18 ANAIN -
19 ANAIN+
20 VCCA
21 VCCA
22
NC
23 /
BUSY
NC 8
NC 7
VSSD 6
VSSD 5
DO 4
DI 3
/CS 2
NC 1
SCLK 33
VCCD 32
VCCD 31
VCCD 30
EXTCLK 29
/INT 28
SAC 27
VSSA 26
VSSA 25
VSSA 24
X Coordinate
Origin
Y Coordinate
0
0
Connect substrate
to ground.
*
9
ANAOUT
-
10
ANAOUT+
11 /
RESET
12 VSSA
13 VSSA
14 VSSA
15 AUDOUT
16 SQLCAP
17 /SQLOUT
18 ANAIN -
19 ANAIN+
20 VCCA
21 VCCA
22
NC
23 /
BUSY
NC 8
NC 7
VSSD 6
VSSD 5
DO 4
DI 3
/CS 2
NC 1
SCLK 33
VCCD 32
VCCD 31
VCCD 30
EXTCLK 29
/INT 28
SAC 27
VSSA 26
VSSA 25
VSSA 24
X Coordinate
Origin
Y Coordinate
0
0
9
ANAOUT
-
10
ANAOUT+
11 /
RESET
12 VSSA
13 VSSA
14 VSSA
15 AUDOUT
16 SQLCAP
17 /SQLOUT
18 ANAIN -
19 ANAIN+
20 VCCA
21 VCCA
22
NC
23 /
BUSY
NC 8
NC 7
VSSD 6
VSSD 5
DO 4
DI 3
/CS 2
NC 1
SCLK 33
VCCD 32
VCCD 31
VCCD 30
EXTCLK 29
/INT 28
SAC 27
VSSA 26
VSSA 25
VSSA 24
X Coordinate
Origin
Y Coordinate
0
0
Connect substrate
to ground.
*
Revision 2.1