Owner manual

APExx08 Series
Rev 1.5 2004/4/20
5
6.0 Bonding Diagram of APE0508 / APE1008
Pad # Pad Name X Y Pad # Pad Name X Y
1
PWM2/Cout -518 -195
9
PRB0 267 -574
2
Vdd1 -518 -479
10
PRB1 377 -574
3
PWM1 -431 -603
11
Vdd2 487 -574
4
GND1 -283 -603
12
GND2 489 -414
5
PRA0 -173 -574
13
OSC 489 -304
6
PRA1 -63 -574
14
PRB2 489 -194
7
PRA2 47 -574
15
PRB3 489 -84
8
PRA3 157 -574
Chip Size :
APE0508 : 1234 um x 1404 um
APE1008 : 1234 um x 1404 um
ROM
PRB3
2
3
4
5
6
7
8
9
10
11
12
13
14
15
PRB2
OSC
Vdd2
GND2
PRB1
PRB0
PRA3
PRA2
PRA1
PRA0
GND1
PWM1
PWM2/Cout
Vdd1
1
(0, 0)
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
X
Y