Owner's manual

Integrated Circuits Inc. aP89042
Ver 3.0 Dec 6, 2006
19
Bonding Diagram
Bonding pad size: 80um x 90um
MODE pad MUST be not connected.
Pad Name Location (X,Y) Pad Name Location (X,Y)
VDD 2199.83, 1276.99 VSS 173.70, 358.65
MODE 1918.34, 1281.99 OUT2 173.70, 138.00
S3 1652.19, 1281.99 OUT3 439.31, 138.00
S4 1448.56, 1281.99 COUT 642.94, 138.00
SBT 1182.62, 1281.99 OSC 1276.09, 138.00
RST 978.99, 1281.99 S5 1745.66, 138.00
S7 713.23, 1281.99 S6 1949.29, 138.00
S8 509.60, 1281.99 VPP 2200.12, 299.45
OUT1 243.99, 1281.99 S1 2200.09, 834.58
VOUT1 173.70, 1014.23 S2 2200.09, 1038.21
VOUT2 713.70, 614.27