Manual

Digital Timing Characteristics The following specifications apply to the ADC12048, 13-bit data bus width,
V
A
a
e
V
D
a
e
5V, f
CLK
e
12 MHz, t
f
e
3 ns and C
L
e
50 pF on data I/O lines
Symbol
Parameter Conditions
Typical Limits Units
(Figure 7) (Note 10) (Note 11) (Limit)
t
TPR
Throughput Rate Sync-Out Mode (SYNC Bit
e
222
kHz
‘‘0’’) 9 Clock Cycles of
Acquisition Time
t
CSWR
Falling Edge of CS to Falling Edge of WR 0ns
t
WRCS
Active Edge of WR to Rising Edge of CS 0ns
t
WR
WR Pulse Width 20 30 ns (min)
t
WRSETFalling
Write Setup Time WMODE
e
‘‘1’’ 20 ns (min)
t
WRHOLDFalling
Write Hold Time WMODE
e
‘‘1’’ 5 ns (min)
t
WRSETRising
Write Setup Time WMODE
e
‘‘0’’ 20 ns (min)
t
WRHOLDRising
Write Hold Time WMODE
e
‘‘0’’ 5 ns (min)
t
CSRD
Falling Edge of CS to Falling Edge of RD 0ns
t
RDCS
Rising Edge of RD to Rising Edge of CS 0ns
t
RDDATA
Falling Edge of RD to Valid Data 8-Bit Mode (BW Bit
e
‘‘0’’) 40 58 ns (max)
t
RDDATA
Falling Edge of RD to Valid Data 13-Bit Mode (BW Bit
e
‘‘1’’) 26 44 ns (max)
t
RDHOLD
Read Hold Time 23 32 ns (max)
t
RDRDY
Rising Edge of RD to Rising Edge of RDY 24 38 ns (max)
t
WRRDY
Active Edge of WR to Rising Edge of RDY WMODE
e
‘‘1’’ 42 65 ns (max)
t
STNDBY
Active Edge of WR to Falling Edge of WMODE
e
‘‘0’’. Writing the 200 230 ns (max)
STDBY
Standby Command into the
Configuration Register
t
STDONE
Active Edge of WR to Rising Edge of WMODE
e
‘‘0’’. Writing the 30 45 ns (max)
STDBY
RESET Command into the
Configuration Register
t
STDRDY
Active Edge of WR to Falling Edge of RDY WMODE
e
‘‘0’’. Writing the 1.4 2.5 ms (max)
RESET Command into the
Configuration Register
t
SYNC
Minimum SYNC Pulse Width 5 10 ns (min)
Notes on Specifications
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND, unless otherwise specified.
Note 3: When the input voltage (V
IN
) at any pin exceeds the power supply rails (V
IN
k
GND or V
IN
l
(V
A
a
or V
D
a
)), the current at that pin should be limited to
30 mA. The 120 mA maximum package input current limits the number of pins that can safely exceed the power supplies with an input current of 30 mA to four.
Note 4: The maximum power dissipation must he derated at elevated temperatures and is dictated by T
Jmax
, (maximum junction temperature), i
JA
(package
junction to ambient thermal resistance), and T
A
(ambient temperature). The maximum allowable power dissipation at any temperature is P
Dmax
e
(T
Jmax
b
T
A
)/
i
JA
or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, T
Jmax
e
150
§
C, and the typical thermal resistance (i
JA
)ofthe
ADC12048 in the V package, when board mounted, is 55
§
C/W, and in the VF package, when board mounted, is 67.8
§
C/W.
Note 5: Human body model, 100 pF discharged through 1.5 kX resistor.
6