User Manual
AC Electrical Characteristics (Continued)
The following specifications apply for V
a
ea
5V, t
r
e
t
f
e
20 ns, V
REF(
a
)
e
5V, V
REF(
b
)
e
GND, and Speed Adjust pin
unconnected unless otherwise specified. Boldface limits apply for T
A
e
T
J
e
T
MIN
to T
MAX
; all other limits T
A
e
T
J
e
a
25
§
C.
Symbol Parameter Conditions
Typical Limit Units
(Note 7) (Note 8) (Limits)
t
MS
Multiplexer Control Setup Time 10 75 ns (max)
t
MH
Multiplexer Hold Time 10 40 ns (max)
C
VIN
Analog Input Capacitance 35 pF (max)
C
OUT
Logic Output Capacitance 5 pF (max)
C
IN
Logic Input Capacitance 5 pF (max)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional. These ratings do not guarantee specific performance limits, however. For guaranteed specifications and test conditions, see the Electrical Characteris-
tics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under
the listed test conditons.
Note 2: All voltages are measured with respect to GND, unless otherwise specified.
Note 3: When the input voltage (V
IN
) at any pin exceeds the power supply rails (V
IN
k
GND or V
IN
l
V
a
) the absolute value of current at that pin should be limited
to 5 mA or less. The 20 mA package input current limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
, i
JA
and the ambient temperature, T
A
. The maximum
allowable power dissipation at any temperature is P
D
e
(T
JMAX
b
T
A
)/i
JA
or the number given in the Absolute Maximum Ratings, whichever is lower. In most
cases, the maximum derated power dissipation will be reached only during fault conditions. For these devices, T
JMAX
for a board-mounted device can be found
from the tables below:
ADC10061
Suffix i
JA
(
§
C/W)
CMJ 54
BIN, CIN 70
BIWM, CIWM 85
ADC10062
Suffix i
JA
(
§
C/W)
CMJ 48
BIN, CIN 60
BIWM, CIWM 82
ADC10064
Suffix i
JA
(
§
C/W)
CMJ 44
BIN, CIN 53
BIWM, CIWM 78
Note 5: Human body model, 100 pF discharged through a 1.5 kX resistor.
Note 6: See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ or the section titled ‘‘Surface Mount’’ found in a current National
Semiconductor Linear Data Book for other methods of soldering surface mount devices.
Note 7: Typicals are at
a
25
§
C and represent must likely parametric norm.
Note 8: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 9: Accuracy may degrade if t
SH
is shorter than the value specified. See curves of Accuracy vs t
SH
.
Note 10: A military RETS electrical test specification is available on request. At time of printing, the ADC10061CMJ/883, ADC10062CMJ/883, and
ADC10064CMJ/883 RETS specification complies fully with the boldface limits in this column.
4