Owner manual

16
T7024
4533A–BLURF–09/02
Gerberfiles are available on request.
The application board consists of 4 layers:
1. top layer: RF-signals, 35 µm Cu
2. spacing: 490 µm FR4
3. second layer: GND, 35 µm Cu
4. spacing: 550 µm FR4
5. third layer: GND (optional), 35 µm Cu
6. spacing: 490 µm FR4
7. bottom layer: DC connection, 35 µm Cu
Figure 30. Application Board N20
1.8p
R1
Var
1n10p
1u
18nH
0p8
2p2
56p
2.2p
100p
1n15p
1u
1n15p 1u
56p
2
3
4
789
12
13
14
171819
1
5
610
11
15
1620
T7024
3p3
R1 is selected
with DIL-switch
pin-diode replaced
by LED on application-
board
harm.
termination
PA OUTV3_PAVS_LNALNA IN
Switch Out
PU
RX ON
LNA OUT
PA IN
V2_PA
V1_PA
PA ramp
100p
1p
1u
Blocking capacitors
depending on application