User guide

10
T7023
4532A–BLURF–09/02
Figure 15. Application Board Layout
Gerberfiles are available on request.
The application board consists of 4 layers:
1. top layer: RF-signals, 35 µm Cu
2. spacing: 490 µm FR4
3. second layer: GND, 35 µm Cu
4. spacing: 550 µm FR4
5. third layer: GND (optional), 35 µm Cu
6. spacing: 490 µm FR4
7. bottom layer: DC connection, 35 µm Cu
1µF1nF
15pF
1µF1nF15pF
3.3pF
hQ
56pF
1µF1nF10pF
1.5pF hQ
15nH hQ
5.6pF hQ
5.6pF
0R
1.5pF