User's Guide

Revision 1.0 Page 5 of 75
nRF24L01+ Preliminary Product Specification
7.5 Automatic packet transaction handling ................................................ 31
7.5.1 Auto Acknowledgement................................................................... 31
7.5.2 Auto Retransmission (ART)............................................................. 31
7.6 Enhanced ShockBurst flowcharts ........................................................ 33
7.6.1 PTX operation.................................................................................. 33
7.6.2 PRX operation ................................................................................. 35
7.7 MultiCeiver™........................................................................................ 37
7.8 Enhanced ShockBurst™ timing ........................................................... 40
7.9 Enhanced ShockBurst™ transaction diagram ..................................... 42
7.9.1 Single transaction with ACK packet and interrupts.......................... 42
7.9.2 Single transaction with a lost packet ............................................... 43
7.9.3 Single transaction with a lost ACK packet ....................................... 43
7.9.4 Single transaction with ACK payload packet ................................... 44
7.9.5 Single transaction with ACK payload packet and lost packet.......... 44
7. 9 .6 Tw o tr a n s a c t i o n s w i t h A C K p a y lo a d pa c k e t a n d t h e f i r s t
ACK packet lost ........................................................................... 45
7.9.7 Two transactions where max retransmissions is reached ............... 45
7.10 Compatibility with ShockBurst™ .......................................................... 46
7.10.1 ShockBurst™ packet format............................................................ 46
8 Data and Control Interface ....................................................................... 47
8.1 Features ............................................................................................... 47
8.2 Functional description .......................................................................... 47
8.3 SPI operation ....................................................................................... 47
8.3.1 SPI Commands ............................................................................... 47
8.3.2 SPI timing ........................................................................................ 49
8.4 Data FIFO ............................................................................................ 52
8.5 Interrupt................................................................................................ 53
9 Register Map.............................................................................................. 54
9.1 Register map table ............................................................................... 54
10 Peripheral RF Information ........................................................................ 61
10.1 Antenna output..................................................................................... 61
10.2 Crystal oscillator................................................................................... 61
10.3 nRF24L01+ crystal sharing with an MCU............................................. 61
10.3.1 Crystal parameters .......................................................................... 61
10.3.2 Input crystal amplitude and current consumption ............................ 61
10.4 PCB layout and decoupling guidelines................................................. 62
11 Application example ................................................................................. 63
11.1 PCB layout examples........................................................................... 64
12 Mechanical specifications........................................................................ 68
13 Ordering information ................................................................................ 70
13.1 Package marking ................................................................................. 70
13.2 Abbreviations ....................................................................................... 70
13.3 Product options .................................................................................... 70
13.3.1 RF silicon......................................................................................... 70
13.3.2 Development tools........................................................................... 70
14 Glossary of Terms..................................................................................... 71