User`s manual

User’s Manual 79

There is a 2" × 4" through-hole prototyping space available on the Prototyping Board.

The

holes in the prototyping area are spaced at 0.1" (2.5 mm).

+3.3 V, +5 V, and GND traces run

along the edge of the Prototyping Board for easy access.

Small to medium circuits can be

prototyped using point-

to-point wiring with 20 to 30 AWG wire between the prototyping

area, the

+3.3 V, +5 V, and GND traces,

and the surrounding area where surface-mount

components may be installed.

Small holes are provided around the surface-mounted com-

ponents that may be installed around the prototyping area.

B.4.1 Adding Other Components

There are two sets of pads for 28-pin devices that can be used for surface-mount prototyp-

ing involving SOIC devices.There are also pads that can be used for SMT resistors and

capacitors in an 0805 SMT package. Each component has every one of its pin pads con-

nected to a hole in which a 30 AWG wire can be soldered (standard wire wrap wire can be

soldered in for point-to-point wiring on the Prototyping Board). Because the traces are

very thin, carefully determine which set of holes is connected to which surface-mount pad.

B.4.2 Measuring Current Draw

The Prototyping Board has a current-measurement feature available on header JP10. Nor-

mally, a jumper connects pins 1–2 and pins 5–6 on header JP10, which provide jumper

connections for the +5 V and the +3.3 V regulated voltages respectively. You may remove

a jumper and place an ammeter across the pins instead, as shown in the example in

Figure B-5, to measure the current being drawn.

Figure B-5. Prototyping Board Current-Measurement Option

JP0

CURRENT

MEASUREMENT

OPTION

+3.3V

+5V