Specifications
NEW FROM DIGI NEW FROM DIGI NEW FROM DIGI NEW FROM DIGI NEW FROM DIGI
Embedded Modules
Digi International
K4
GPIO (50 Pins)
44.25, 38.75, or 25.75 MHz Peripheral Bus
32b-D, 32b-A
27-Channel DMA
ts
oHBSU
I
2
C
rellortnoCDCL
reg
anaMr
e
woP
noitareneGKLC
tpurretnIderotceV
rellortnoC
retibrABHA
GATJ
001/01
tenrehtE
I
I
MR/IIM
CAM
retib
r
AsuB
yromeM
rellortnoC
.txE
lar
e
hpi
r
eP
rellortnoC
suBBHAzHM5.15ro,5.77,5.88
A-b23,
D
-b2
3
MRA
s
r
e
t
n
u
o
C
/sr
emi
Tx8
MWP4ro
laireS
elu
d
oM
4x
TRAU
eciveDBSU
S-JE629MRA
zHM301ro,551,771
ehcaC-IBk8
ehcaC-DBk4
7 GPIO
laeR
emiT
kcolC
4821
15 GPIO
IPS
B
M8/4
RON
hsalF
otpU
BM652
DNAN
hsalF
otpU
BM652
MARDS
11.208
g/b/a
oidaR
144-pin SO-DIMM Edge Connector
buHBSU
AepyT
rotcennoC
redaeH
54-JR
YHP
AMS-PR
LF.U
Keypad
Interface
General Purpose I/O
100-Pin Connector
100-Pin Connector
Peripheral Bus
Address and Data Bus
USB
Host
Controller
64MB SDRAM
10/100 Ethernet
32MB SDRAM
32.768
kHz
Osc
13
MHz
Osc
RTC
OS Timers
4 x PWM
3 x SSP
1
2
S
AC ‘97
Standard
UART
Full-Function
UART
Bluetooth
UART
Intel
XScale
®
Core
Intel
®
Wireless
MMX™
Debug
Controller
Fast
Infrared
DM A
Controller
and
Bridge
System Bus
Intel
Quick
Capture
Interface
Internal
SRAM
LCD
Con-
troller
Memory
Controller
Address
and
Data
Variable
Latency
I/O
Control
Dynamic
Memory
Control
Static
Memory
Control
Power
Management/
Clock Control
Power
Management IC
1024-Bit EEPROM
PC Card/
Compact
Flash
Control
1
2
C
USB Client
Controller
MSL
Interface
Memory Stick
Interface
USB
On-The-Go
MMC/SD/SDIO
Interface
USIM
Interrupt
Controller
Primary
GPIO
30
www.mouser.com/digi
860-CC-W9C-GN CC-W9C-GN ConnectCore Wi-9C NET+Works GNU Development Kit 2495.00 Call
860-CC-WI-9C CC-WI-9C ConnectCore Wi-9C Module 638.00 638.00
(800) 346-6873
DIGI INTERNATIONAL Embedded Modules & Development Tools
Highly integrated, compact SO-DIMM form factor core module based on the powerful NetSilicon® NS9360 processor combines main processing functionality with on-board secure wireless and wired
network connectivity. Built on leading 32-bit NET+ARM technology, the ConnectCore Wi-9C module is a powerful network-enabled core processor solution. Its unique design combines main processor
performance, secure wireless/wired network connectivity, embedded software and hardware design flexibility, and a seamless migration path to a fully integrated System-on-chip solution.
DIGI CONNECTCORE™ WI-9C, 32-BIT 155 MHZ ARM 9 CORE MODULE
MOUSER
STOCK NO.
Description
Price Each
Digi
Part No.
Features:
•
Compact SO-DIMM Core Module
•
Powerful 32-bit NS9360 w/ARM926EJ-S core
•
Up to 256 Mbyte SDRAM/Flash
•
802.11b/g or 802.11a/b/g with strong
WPA2/802.11i security
•
10/100 Mbit Ethernet interface
•
I/O connectivity options: USB, UART,
I2C, SPI, PWM, GPIO
•
On-chip LCD controller
•
Industrial operating temperature
•
Pre-certified radio reduces cost, design risk
and time to market
•
FCC Class B compliant low emissions design
•
Population options for unique design flexibility
•
Complete embedded software platform offering with
support and design services: ThreadX® ,
Microsoft® Windows® CE, Linux
110
For quantities of 50 and up, call for quote.
Hardware:
•
32-bit NS9360 high-performance RISC
processor @ 155 MHz
•
Up to 256 MB Flash and 256 MB SDRAM
•
Up to 4 Serial and SPI ports
•
I2C v1.0 bus interface
•
USB 2.0 host/device full speed interface
•
On-chip LCD controller for TFT / STN LCD
•
Up to 8 programmable timers/counters
•
Up to 4 PWM functions
•
Four programmable external interrupts
•
Up to 55 shared General Purpose
Input/Output (GPIO) ports
•
Real-time clock
Environmental:
•
Storage temperature:
-50° C to 125° C (-58° F to 257° F)
•
Operating temperature:
-40° C to 85° C (-40° F to 185° F)
•
Relative humidity:
5% to 90% (non-condensing)
•
Altitude: 12,000 feet (3,658 meters)
•
3.3VDC @ 800 mA max
Network Interface:
Wired
•
Standard: IEEE 802.3
•
Physical layer: 10/100Base-T
•
Data rate: 10/100 Mbps (auto-sensing)
•
Mode: Full or half duplex (auto-sensing)
•
Connector: RJ-45 w/magnetics (optional )
Wireless
•
Standard: IEEE 802.11b/g
- Frequency: 2.4 GHz -Data rate: Up to 54 Mbps w/fallback
-Modulation: DBPSK (1 Mbps), DQPSK (2 Mbps),
CCK (11,5.5 Mbps), BPSK (6,9 Mbps),
QPSK (12,18 Mbps), 16-QAM (24,
36 Mbps), 64-QAM (48, 54 Mbps)
-Transmit power: 16 dBm typical
-Receive sensitivity: -73 dBm @54Mbps
•
Standard: IEEE 802.11a
-Frequency: 5 GHz
-Data rate: Up to 54 Mbps w/fallback
-Modulation: BPSK (6,9 Mbps), QPSK (12, 18 Mbps),
16 QAM (24, 36 Mbps), 64-QAM (48, 54 Mbps)
-Transmit power: 16 dBm typical
-Receive sensitivity: -66 dBm @ 54 Mbps
•
Connector: 1/2 x RP-SMA or 2 x U.FL
Wireless Security:
WEP (Wired Equivalent Privacy)
•
64/128-bit encryption (RC4)
WPA/WPA2/802.11i
•
128-bit TKIP/CCMP(AES) encryption
•
802.1x EAP authentication
- LEAP (WEP only), PEAP, TTLS, TLS
-GTC, MD5, OTP, PAP, CHAP, MSCHAP,
MSCHAPv2, TTLS-MSCHAPv2
-Pre-shared key mode (PSK)
Dimensions:
•
Length: 3.06 in (7.76 cm)
•
Width: 3.59 in (9.12 cm)
•
Height: 0.80 in (2.03 cm)
High-performance core module with Intel XScale processor provides complete embedded platform support, combining industry-leading performance,
multimedia capabilities and low power requirements in an ulta-compact form factor. The ConnectCore XP module introduces high-performance Intel
XScale technology to the ConnectCore™ family of network-enabled embedded core processor modules. It provides the core processor platform
solution of choice for applications demanding the combination of scalable Intel PXA270 performance at speeds up to 520 MHz, on-chip video and
audio capabilities, low power requirements, integrated network connectivity, and complete embedded software platform flexibility. The ConnectCore
XP offers a complete system on a module in an ultra-compact form factor with processor, on-board memory, integrated 10/100 Mbit network interface,
LCD controller (VGA/SVGA), AC’97 and I2S audio codec interfaces, plus a complete set of peripheral connectivity options such as SSP/NSSP, I2C,
UARTs, and IrDA. The external 32-bit address/ data bus interface provides additional flexibility and almost unlimited design freedom.
DIGI CONNECTCORE™ XP, 32-BIT 520 MHZ INTEL XSCALE CORE MODULE
Features:
•
Intel PXA270 processor with Intel
XScale microarchitecture core
•
64 MB SDRAM and 32 MB Intel StrataFlash®
•
Wide variety of I/O connectivity options
•
Strong multimedia capabilities w/LCD
controller and audio interfaces
•
Comprehensive USB 1.1 host/device
interface support, plus USB 2.0 OTG
•
Memory/expansion card interfaces
•
External 32-bit memory bus interface
•
Low-power requirements
•
Complete embedded software platform offering
w/support and design services -Microsoft
Windows CE and Linux
Ethernet Interface:
•
Standard: IEEE 802.3
•
Physical layer: 10/100Base-T
•
Data rate: 10/100 Mbps (auto-sensing)
•
Mode: Full or half duplex (auto-sensing)
Hardware:
•
32-bit Intel XScale PXA270 high-performance RISC processor @ 520 MHz
•
32 MB Intel StrataFlash and 64 MB SDRAM on-board
•
1024-bit 1-Wire® EEPROM
•
Integrated 10/100 Mbps Ethernet MAC/PHY
•
On-chip LCD controller for TFT/STN LCD panels – Up to SVGA (800x600)
resolution w/up to 24 bpp color depth
•
On-board USB 1.1 host/device and USB 2.0 OTG interface
– Full speed (12 Mbps) and low speed (1.5 Mbps) modes
•
2 SSP/NSSP ports – Synchronous Serial Protocol (SSP),
Serial Peripheral Interface (SPI), Microwire,
Programmable Serial Protocol (PSP) modes
•
1 full-function UART w/maximum data rate of 921kbps –
TX, RX, RTS, CTS, DTR, DSR, DCD, RI
•
1 Bluetooth UART w/maximum data rate of 921kbps –
TX, RX, RTS, CTS
•
Fast Infrared Communications Port (FICP) – Up to 4 Mbps
half-duplex operation
•
1 I2C bus interface w/fast mode (400 KHz) support
•
I2S interface and AC’97 audio controller
•
2 Pulse Width Modulator (PWM) signals
•
Memory and expansion card interfaces
– PCMCIA/CompactFlash®, SD/SDIO, MMC,
and Memory Stick
•
32-bit external memory bus interface
•
Up to 75 GPIO port options
•
On-board JTAG interface
Environmental:
•
Storage temperature:
-50° C to +125° C (-58° F to +257° F)
•
Operating temperature:
0° C to 70° C (32° F to 158° F)
•
Relative humidity:
5% to 90% (non-condensing)
Power Requirements:
•
3.3VDC @ 190/350 mA (min/max)
Dimensions:
•
Length: 2.661 in (6.760 cm)
•
Width: 1.444 in (3.670 cm)
•
Height: 0.192 in (0.490 cm)
860-FS-9077 FS-9077 LxNETES 3.2 Development Kit 2495.00 Call
860-FS-377 FS-377 ConnectCore XP 270 (520 MHz, 32/64) 295.00 295.00
MOUSER
STOCK NO.
Description
Price Each
Digi
Part No.
110
For quantities of 50 and up, call for quote.
Block Diagram
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Check mouser.com for RoHS status.
© Copyright 2007 Mouser Electronics
© Copyright 2007 Mouser Electronics
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