Datasheet

MF1S50YYX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196330 3 of 39
NXP Semiconductors
MF1S50yyX
MIFARE Classic 1K - Mainstream contactless smart card IC
5. Ordering information
6. Block diagram
Table 2. Ordering information
Type number Package
Name Description Version
MF1S5001XDUD FFC Bump 8 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S5001XDUF FFC Bump 8 inch wafer, 75 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S5000XDA4 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-2
MF1S5000XDA8 MOA8 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-4
MF1S5031XDUD FFC Bump 8 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S5031XDUF FFC Bump 8 inch wafer, 75 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S5030XDA4 MOA4 plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-2
MF1S5030XDA8 MOA8 plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-4
Fig 2. Block diagram of MF1S50yyX
001aan006
RF
INTERFACE
UART
ISO/IEC 14443
TYPE A
LOGIC UNIT
RNG
CRC
EEPROM
CRYPTO1
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR