Operating Guide

BGA2015 OPERATION MANUAL
Page17
B. Select the required flow, if need to modify, perform relevant operation.
C. Select “desolder” working mode.
D. Select “IR” laser alignment mode.
E. No change to communication speed, and press OK key to exit. IR window shows:
F. Press START key and the system start working, perform content of selected flow.
7. After pressing START key, Bottom Heater starts to heat up and Top Heater moves downwards and reach
to bottom.
8. IR window will show a series of setting temperatures during working. Indicate when it reaches T0, T1,
T2, T3 and TL. When the bottom temperature reaches T0, the top heater begins to heat up.
9. When the temperature reaches TL, it will give a sound alert automatically (Low frequency).
10. When the temperature reaches T3, it will also give a sound alert automatically. (Middle frequency)
11. When the solder has melted down, press the vacuum suction tube to pick up the component.
12. Press the vacuum suction tube, the vacuum pump start to work and pick up component, then return to
original position. The system stops heating.
13. The Top Heater moves upwards and stops at top.
14. Top Cooling fan and Outside Cooling Fan spreads out to blow cooling air simultaneously.
15. 90 seconds after the top heater starts moving upwards, the vacuum suction tube looses component
automatically.
16. After the two Cooling Fans blow cooling air for 150 seconds, the whole de-soldering process will be
over.
9. PL System Operation
9.1 Component function
1.
Crosswise Cooling Fan
Besides the existing top cooling system, the system adds outside Cooling Fan again to speed up the cooling
process of PCB.
2、
PCB fixture
* The movable PCB fixture is able to fix PCBs of different sizes. It has four Fixing Knobs and two
TC:022˙C Tb:019˙
C
ready for flow