2020 Installation Guide

BI 7.2.3-46
Feb-2021, Rev 14
BI 7.2.3-46
Feb-2021, Rev 14
8
As shown in Image 2.4.4 and 2.4.5, the QRail Clamps with QClick
Technology and rails are designed with sharp hooks. When the clamp
is installed in the rail and the bolt is tightened, the bolt forces the hooks
into the rail. Then, as the clamp engages the module and the bolt is
tightened to the recommended torque specification [144 in-lbs (16 N-m)
for Mid Clamps and 96 in-lbs (11 N-m) for End Clamps], these hooks
are pulled into the QClick channel and penetrate the aluminum oxide or
painted coating on the rail and electrically bond to the rail, clamp, and
bolt. A serrated flange bolt head serves to electrically bond the bolt to the
body of the mid or end clamp, thus forming a secure electrical bonding
Bonding with QClick Technology®
PV module frames are electrically bonded to the QRail system by the bonding mid clamps. Bonding
mid clamps are preassembled and bonded with stainless steel bonding pins below the clamp head.
The stainless steel bonding pins pierce the oxide of the PV module, forming an electrical bond
between the module, the clamp head, and thus to the rest of the QRail system. Bonding mid clamps
are available in either mill or black finish.
Universal height end clamps may be converted to bonding
version by adding optional bonding clips (WEEB-BMC-1
1
).
Bonding versions of the end clamps are useful when mounting
a single module or in shared rail configuration where bonding
mid clamps are not utilized. The WEEB-BMC-1 is a stainless
steel bonding clip formed with spikes that pierce the oxide of
the clamp head and the PV module, forming an electrical bond
between the module, the clamp head, and thus
to the rest of the QRail system.
PV Module Bonding
NOTE!
The installer is responsible for and shall provide an appropriate
method of direct-to-earth grounding according to the latest
edition of the National Electrical Code, including NEC 250:
Grounding and Bonding and NEC 690: Solar Photovoltaic
Systems.
The QRail Hidden End Clamp is NOT a bonding solution
and therefore in the case of orphaned modules, an alternative
listed module grounding device in conjunction with all
rails being grounded must be utilized. See Diagram 2.4.3.
Alternatively, use Universal End Clamps with WEEB-BMC
installed per diagram 2.4.10.
Image 2.4.4
Clamp hooks
Image 2.4.5
Clamp hooks and rail
Image 2.4.6
Clamp bonding path
Image 2.4.7
Bonding plate mid clamp
[144 in-lbs (16 N-m)]
Image 2.4.8
Fixed end clamp
[96 in-lbs(11 N-m)]
Image 2.4.9
Universal end clamp
[96 in-lbs (11 N-m)]
Image 2.4.10-1
Universal end clamp
w/WEEB-BMC
[96 in-lbs (11 N-m)]
hooks
1
WEEB-BMC -1 is evaluated as an alternative component and maybe used interchangeably with a WEEB-BMC Bonding Clip.