Specifications

L70 Hardware Design
L70_HD_V1.0 - 31 -
Figure 19: Footprint of recommendation（Unit:mm）
Notes ：
1. The keep-out area should be covered by solder mask and top silk layer for isolation between the
top layer of host board and the bottom layer of the module.
2. For easy maintenance of this module and accessing to these pads, please keep a distance of no
less than 3mm between the module and other components in host board.
6.3. Top view of the module
Figure 20: Top view of the module
1
9
18
10
Keep Out
Quectel
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