Product Info

Smart Module Series
SC200R Series Hardware Design
SC200R_Series_Hardware_Design 114 / 125
Temp. (°C)
Reflow Zone
Soak Zone
246
200
220
238
C
D
B
A
150
100
Max slope: 1 to 3°C/s
Cooling down slope
:
-1.5 to -3°C/s
Max slope:
2 to 3°C/s
Figure 45: Recommended Reflow Soldering Thermal Profile
Table 59: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C) 70–120 s
Reflow Zone
Max slope 2–3 °C/s
Reflow time (D: over 220°C) 45–70 s
Max temperature 238 °C to 246 °C
Cooling down slope -1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle 1