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FC909A

Hardware Design

Wi-Fi&Bluetooth Module Series

Version: 1.0.0

Date: 2022-01-13

Status: Preliminary

Summary of content (53 pages)

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FC909A Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.
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Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
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Wi-Fi&Bluetooth Module Series Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
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Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal shall notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
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Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description - 2022-01-13 Macky XU Creation of the document 1.0.
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Wi-Fi&Bluetooth Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents ....................................................................................................................................................
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Wi-Fi&Bluetooth Module Series 4.4. RF Connector Recommendation ............................................................................................ 36 5 Electrical Characteristics & Reliability .......................................................................................... 38 5.1. Electrical Characteristics ........................................................................................................ 38 5.2. I/O Interface Characteristics .....................................
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Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark.............................................................................................................................. 13 Table 2: Key Features ............................................................................................................................. 14 Table 3: I/O Parameters Definition ..........................................................................................................
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Wi-Fi&Bluetooth Module Series Figure Index Figure 1: VBAT Circuit Reference Design ............................................................................................... 20 Figure 2: Power On Timing ..................................................................................................................... 21 Figure 3: Recommended Reference Design Circuit ................................................................................ 22 Figure 4: WLAN Application Interfaces Connection...
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Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FC909A and describes its air interfaces and hardware interfaces which are connected with your application. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, you can use FC909A to design and set up applications easily.
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Wi-Fi&Bluetooth Module Series compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions).
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Wi-Fi&Bluetooth Module Series Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.
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Wi-Fi&Bluetooth Module Series autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 10224A-2022FC909A”.
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Wi-Fi&Bluetooth Module Series 1.1. Special Mark Table 1: Special Mark Mark Definition * Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable.
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Wi-Fi&Bluetooth Module Series 2 Product Overview 2.1. General Description FC909A is a Wi-Fi and Bluetooth module with low power consumption. It is a single-die WLAN (Wireless Local Area Network) and Bluetooth combo solution supporting IEEE 802.11b/g/n 2.4 GHz WLAN standards and Bluetooth 5.1 standard which enables seamless integration of WLAN and Bluetooth low energy technologies. With a SDIO 2.
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Wi-Fi&Bluetooth Module Series 1 Wi-Fi Transmitting Power 2.4 GHz:  802.11b/11 Mbps: 16 dBm ±1.5 dBm  802.11g/54 Mbps: 15 dBm ±1.5 dBm  802.11n/HT20 MCS7: 14 dBm ±1.5 dBm Wi-Fi Operation Mode   Wi-Fi Modulation DSSS, OFDM, DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM WLAN Application Interface SDIO 2.0 Bluetooth Application Interface UART and PCM RF Antenna Interfaces   ANT_WIFI0/BT 50 Ω impedance Physical Characteristics    Size: (12.0 ±0.15) mm × (12.0 ±0.15) mm × (1.95 ±0.
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Wi-Fi&Bluetooth Module Series NOTE FC909A supports internal crystal or external crystal. 2.3. EVB To help customers to develop applications with FC909A, the evaluation board tools include EVB board (FC909A-M.2 and corresponding TE-A), USB 2.0 data cable, antenna and other external devices used to control and test the module. For details, see document [1].
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Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. General Description FC909A is equipped with 44 LCC pins. The subsequent chapters will provide a detailed introduction to the following function, pins and interfaces of the module:      Power supply WLAN application interfaces Bluetooth application interfaces RF antenna interfaces Other interfaces -WLAN_SLP_CLK -XTAL_IN/OUT -GPIOs 3.2. Pin Description The following tables show the pin description of FC909A.
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Wi-Fi&Bluetooth Module Series Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description VBAT 9 PI Power supply for the module VDDIO 22 PI Power supply for module’s I/O pins VIN_LDO_OUT 21 PO Internal buck output for the module VIN_LDO 23 PI Internal buck input for the module GND 1, 3, 20, 31, 33, 36 Comment WLAN Application Interface Pin Name Pin No. I/O Description Comment WLAN_EN 12 DI WLAN function enable control VDDIO power domain. Active high.
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Wi-Fi&Bluetooth Module Series HOST_WAKE_BT 6 DI Host wakes up Bluetooth BT_WAKE_HOST 7 DO Bluetooth wakes up host PCM_DOUT 25 DO PCM data output PCM_CLK 26 DI PCM clock PCM_DIN 27 DI PCM data input PCM_SYNC 28 DI PCM data frame sync BT_RTS 41 DO Bluetooth UART request to send BT_TXD 42 DO Bluetooth UART transmit BT_RXD 43 DI Bluetooth UART receive BT_CTS 44 DI Bluetooth UART clear to send VDDIO power domain. If unused, keep them open.
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Wi-Fi&Bluetooth Module Series NOTE The module supports external crystal or built-in crystal, so XTAL_IN and XTAL_OUT are optional pins. 3.3. Power Supply 3.3.1. Power Supply Pins Table 5: Pin Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT 9 Power supply for the module 3.0 3.6 4.8 V VDDIO 22 Power supply for module’s I/O pins 1.71 1.8/3.3 3.63 V GND 1, 3, 20, 31, 33, 36 Ground FC909A is powered by VBAT.
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Wi-Fi&Bluetooth Module Series The following figure shows the recommended power on/off sequences for the module: Sleep Clock 90% VH VBAT VDDIO 2 Sleep Cycles WLAN_EN BT_EN Figure 2: Power On Timing It is recommended that VBAT shall be powered on no later than VDDIO. 3.3.2. Buck Circuit Pins Table 6: Definition of Buck Circuit Pins Pin Name Pin No. Description Min. Typ. Max. VIN_LDO_OUT 21 Internal buck output for the module - - - VIN_LDO 23 Internal buck input for the module - 1.
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Wi-Fi&Bluetooth Module Series Figure 3: Recommended Reference Design Circuit Table 7: Recommended Inductance Parameters Parameter Recommend Unit Inductance 2.2 μH Tolerance ±20 % / DCR < 0.2 Ω Rated current (based on temperature rise） 1.15 A 3.4. WLAN Application Interfaces The following figure shows the WLAN application interfaces connection between FC909A and the host. Host FC909A SDIO WLAN_EN WLAN_WAKE SDIO WLAN_EN WLAN_WAKE Figure 4: WLAN Application Interfaces Connection 3.4.1.
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Wi-Fi&Bluetooth Module Series Table 8: Pin Definition of SDIO Interface Pin Name Pin No. 1-bit Mode 4-bit Mode SDIO_DATA2 14 NC SDIO data bit 2 SDIO_DATA3 15 NC SDIO data bit 3 SDIO_CMD 16 SDIO command SDIO command SDIO_CLK 17 SDIO clock SDIO clock SDIO_DATA0 18 SDIO data bit 0 SDIO data bit 0 SDIO_DATA1 19 IRQ SDIO data bit 1 The following figure shows the SDIO interface connection between FC909A and host.
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Wi-Fi&Bluetooth Module Series Figure 5: SDIO Interface Connection To ensure that the interface design complies with the SDIO 2.0 specification, the following principles are recommended to be adopted:      Route the SDIO traces in inner-layer of the PCB and the impedance is controlled at 50 Ω ±10 %. SDIO signals need to be kept away from sensitive signals, such as radio frequency, analog signals, clocks, and DC-DC noise signals.
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Wi-Fi&Bluetooth Module Series Table 10: Pin Definition of WLAN_WAKE Pin Name Pin No. I/O Description Comment WLAN_WAKE 13 DO Wake up the host by WLAN VDDIO power domain. If unused, keep it open.
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Wi-Fi&Bluetooth Module Series 3.4.4. Introduction of WLAN Pin Multiplexing Function Table 11: Pin Setting Description SDIO_DATA2 Mode L SPI* Note Sampling at power-on reset. SDIO H As shown in the table above, SDIO and SPI* modes can be configured through SDIO_DATA2. Table 12: Pin Definition of SDIO Interface Pin Name Pin No.
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Wi-Fi&Bluetooth Module Series 3.5. Bluetooth Application Interfaces The following figure shows the block diagram of Bluetooth application interfaces connection between FC909A and the host. Host FC909A UART UART PCM PCM BT_EN BT_EN BT_WAKE_HOST GPIO1 HOST_WAKE_BT GPIO2 Figure 6: Block Diagram of Bluetooth Application Interfaces Connection 3.5.1. UART FC909A supports an HCI UART as defined in Bluetooth Core Specification Version 5.1.
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Wi-Fi&Bluetooth Module Series The voltage range of the Bluetooth UART of FC909A is determined by VDDIO. It is necessary to pay attention to whether the voltage range of the host and FC909A Bluetooth UART is consistent. If necessary, voltage-level translator shall be adopted. The following figure shows a reference design for UART connection between FC909A and the host.
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Wi-Fi&Bluetooth Module Series 3.5.3. BT_WAKE_HOST and HOST_WAKE_BT BT_WAKE_HOST and HOST_WAKE_BT are used to wake up Bluetooth function. Table 15: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT Pin Name Pin No. I/O Description Comment HOST_WAKE_BT 6 DI Host wakes up Bluetooth function VDDIO power domain. BT_WAKE_HOST 7 DO Bluetooth function wakes up host 3.5.4. PCM Interface PCM interface is used for audio over Bluetooth. The following table shows the pin definition of PCM interface.
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Wi-Fi&Bluetooth Module Series 3.6. Other Interfaces 3.6.1. WLAN_SLP_CLK The 32.768 kHz sleep clock is used in low power modes, such as IEEE power saving mode and sleep mode. It serves as a timer to determine when to wake up the FC909A to receive signals in various power saving schemes, and to maintain basic logic operations when the module is in sleep mode. Table 17: Pin Definition of WLAN_SLP_CLK Pin Name Pin No. I/O Description WLAN_SLP_CLK 24 DI External 32.768 kHz low power clock input.
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Wi-Fi&Bluetooth Module Series Table 19: XTAL_IN/OUT Parameter Definition Parameter Min Typ. Max Unit Frequency - 26 - MHz load capacitance - 12 - pF ESR - 60 - Ω Drive level 200 - - μW Frequency tolerance Initial + over temperature -20 - 20 ppm 3.6.3. GPIOs GPIO1/GPIO2 are function configuration pins, which can be used to enter JTAG mode. If you need, please contact Quectel Technical Supports. Table 20: Pin Definition of GPIOs Pin Name Pin No.
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Wi-Fi&Bluetooth Module Series 4 RF Antenna Interfaces 4.1. RF Antenna Pin 2 is the RF antenna pin, And the RF port has an impedance of 50 Ω. 4.1.1. Antenna Interface & Frequency Bands The pin definition is shown below: Table 21: Pin Definition of RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_WIFI0/BT 2 AIO Wi-Fi0/Bluetooth antenna interface 50 Ω impedance. Table 22: FC909A Operating Frequency Feature Frequency Unit 2.4 GHz Wi-Fi 2.412–2.462 GHz Bluetooth 2.402–2.
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Wi-Fi&Bluetooth Module Series D1 shall be placed as close to the antenna as possible. The NM in the figure below is not attached by default. J1 ANT_WIFI0/BT R1 0R C1 NM C2 NM L1 NM D1 NM C3 NM Figure 9: Reference Circuit for RF Antenna Interface 4.2. Reference Design of RF Routing For user’s PCB, the characteristic impedance of all RF traces shall be controlled to 50 Ω.
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Wi-Fi&Bluetooth Module Series Figure 11: Coplanar Waveguide Design on a 2-layer PCB Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles shall be complied with RF layout design:   Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
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Wi-Fi&Bluetooth Module Series     connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, ground vias around RF traces and the reference ground improves RF performance.
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Wi-Fi&Bluetooth Module Series 4.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 14: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 15: Mechanicals of U.
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Wi-Fi&Bluetooth Module Series The following figure describes the space factor of mated connector. Figure 16: Space Factor of Mated Connector (Unit: mm) For more details, please visit https://www.hirose.com.
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Wi-Fi&Bluetooth Module Series 5 Electrical Characteristics & Reliability 5.1. Electrical Characteristics Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table . Table 25: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT -0.3 5.5 V Digital I/O Input Voltage -0.3 3.9 V The following table shows the recommended operating conditions of the module . Table 26: Recommended Operating Conditions Parameter Min. Typ.
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Wi-Fi&Bluetooth Module Series 5.2. I/O Interface Characteristics The following table shows the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 27: General DC Electrical Characteristics for 1.8 V Domain Symbol Parameter Min. Max. Unit VIH High-level Input Voltage 0.65 × VDDIO - V VIL Low-level Input Voltage - 0.35 × VDDIO V VOH High-level Output Voltage VDDIO - 0.45 - V VOL Low-level Output Voltage - 0.
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Wi-Fi&Bluetooth Module Series 802.11n (HT20) TX 54 Mbps @15 dBm 200 0.6 mA TX MCS0 @ 14 dBm 260 0.6 mA TX MCS7 @ 14 dBm 190 0.6 mA 5.4. RF Performance The following tables summarize the transmitting and receiving performances of FC909A. 5.4.1. Wi-Fi Performance Table 30: Conducted RF Output Power at 2.4 GHz Wi-Fi Description Min. Typ. Unit 802.11b @ 1 Mbps 15.8 16 dBm 802.11b @ 11 Mbps 15.9 16 dBm 802.11g @ 6 Mbps 15.3 15 dBm 802.11g @ 54 Mbps 15.2 15 dBm 802.
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Wi-Fi&Bluetooth Module Series 802.11n, HT20 @ MCS7 -71 dBm 5.4.2. BLE Performance Table 32: BLE Transmitting and Receiving Performance Description Transmitting Power (Typ.) Receiving Sensitivity (Typ.) Unit BR 9 -88 dBm EDR (π/4-DQPSK) 8 -90 dBm EDR (8DPSK) 8 -84 dBm BLE 8 -90 dBm 5.5. ESD Protection The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components.
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Wi-Fi&Bluetooth Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of FC905A. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 6.1.
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Wi-Fi&Bluetooth Module Series Pin 1 Figure 18: Bottom Dimension NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
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Wi-Fi&Bluetooth Module Series 6.2. Recommended Footprint Figure 19: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.
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Wi-Fi&Bluetooth Module Series 6.3. Top and Bottom Views Figure 20: Top and Bottom Views of FC909A NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, refer to the module received from Quectel.
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Wi-Fi&Bluetooth Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature shall be 23 ±5 °C and the relative humidity shall be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
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Wi-Fi&Bluetooth Module Series Table 34: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 217 °C) 40–70 s Max temperature 235–246 °C Cooling down slope -1.5– -3 °C/s Reflow Cycle Max reflow cycle 1 NOTE 1.
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Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow: 7.3.1. Carrier Tape Dimension details are as follow: Figure 22: Carrier Tape Dimension Drawing Table 35: Carrier Tape Dimension Table (Unit: mm) W P T A0 B0 K0 K1 F E 24 16 0.35 12.4 12.4 2.6 3.6 11.5 1.75 7.3.2.
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Wi-Fi&Bluetooth Module Series Table 36: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 W 330 100 24.5 7.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it.
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Wi-Fi&Bluetooth Module Series 8 Appendix References Table 37: Related Documents SN Document Name [1] Quectel_UMTS<E_EVB_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_Secondary_SMT_Application_Note Table 38: Terms and Abbreviations Abbreviation Description AP Access Point BLE Bluetooth Low Energy BPSK Binary Phase Shift Keying BT Bluetooth CCK Complementary Code Keying CTS Clear To Send DQPSK Differential Quadrature Reference Phase Shift Keying GATT Generi
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Wi-Fi&Bluetooth Module Series Mbps Million Bits Per Second QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RoHS Restriction of Hazardous Substances STA Spike-triggered average RTS Request to Send RXD Receive Data TBD To Be Determined TXD Transmit Data UART Universal Asynchronous Receiver/Transmitter USB Universal Serial Bus VIHmax Maximum High-level Input Voltage VIHmin Minimum High-level Input Voltage VILmax Maximum Low-level Input Vol