EC200U Series Hardware Design LTE Standard Module Series Version: 1.1.
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LTE Standard Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”).
LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Standard Module Series About the Document Revision History Version Date Author Description - 2021-10-08 King MA/ Nathan LIU Creation of the document 1.0 2021-11-05 King MA/ Nathan LIU First official release 1.1.
LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents .......................................................................................................................................................
LTE Standard Module Series 3.13. PCM Interface .......................................................................................................................... 45 3.14. Analog Audio Interfaces........................................................................................................... 46 3.14.1. Notes on Audio Interface Design ................................................................................... 47 3.14.2. Microphone Interface Circuit ..................................
LTE Standard Module Series 7.3.3. 8 Packaging Process ........................................................................................................ 91 Appendix References ........................................................................................................................
LTE Standard Module Series Table Index Table 1: Special Marks ................................................................................................................................. 8 Table 2: Frequency Bands of EC200U-CN Module ..................................................................................... 9 Table 3: Frequency Bands of EC200U-EU Module ..................................................................................... 9 Table 4: Frequency Bands of EC200U-AU Module ......
LTE Standard Module Series Table 42: Operating and Storage Temperatures ........................................................................................ 70 Table 43: EC200U-CN Current Consumption ............................................................................................ 70 Table 44: EC200U-EU Current Consumption ............................................................................................ 72 Table 45: EC200U-AU Current Consumption ...................................
LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 13 Figure 2: Pin Assignment (Top View) ......................................................................................................... 15 Figure 3: Sleep Mode Application via UART ..............................................................................................
LTE Standard Module Series Figure 42: Reflow Soldering Thermal Profile ............................................................................................. 88 Figure 43: Carrier Tape Dimension Drawing .............................................................................................. 90 Figure 44: Plastic Reel Dimension Drawing .............................................................................................. 90 Figure 45: Packaging Process ..................................
LTE Standard Module Series 1 Introduction This document defines the EC200U series module and describes its air interface and hardware interfaces which are connected with your applications. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC200U series module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference.
LTE Standard Module Series 2 Product Overview 2.1. General Description EC200U series is a wireless communication module, which supports LTE-FDD, LTE-TDD, GSM/GPRS network data connection. It provides voice function for your special applications and also supports GNSS. The following table shows the frequency bands of the module.
LTE Standard Module Series GNSS 2 GPS, GLONASS, BeiDou, Galileo, QZSS Bluetooth and Wi-Fi Scan 3 Support Table 4: Frequency Bands of EC200U-AU Module Network Mode Frequency Band LTE-FDD B1/B2/B3/B4/B5/B7/B8/B28/B66 LTE-TDD B38/B40/B41 GSM 1 GSM850/GSM900/DCS1800/PCS1900 GNSS 2 GPS, GLONASS, BeiDou, Galileo, QZSS Bluetooth and Wi-Fi Scan 3 Support With a compact profile of 28.0 mm × 31.0 mm × 2.
LTE Standard Module Series ⚫ ⚫ GSM Features FDD: Max. 10 Mbps (DL), Max. 5 Mbps (UL) TDD: Max. 8.96 Mbps (DL), Max. 3.1 Mbps (UL) GPRS: ⚫ Supports GPRS multi-slot class 12 ⚫ Coding scheme: CS-1, CS-2, CS-3 and CS-4 ⚫ Max. 85.6 kbps (DL)/Max. 85.
LTE Standard Module Series Interfaces ADC Interfaces ⚫ Three ADC interfaces USB_BOOT Interface ⚫ Forced download interface ⚫ Compliant with 3GPP TS 27.007, 3GPP TS 27.
LTE Standard Module Series ANT_MAIN ANT_BT/WIFI_SCAN ANT_GNSS SAW PAM LNA SAW Duplex VBAT_RF GNSS APT PA PRx Tx 26 MHz DCXO MIC LOUDSPK VBAT_BB Transceiver 32 kHz Clock PMIC Baseband Control PWRKEY SPI Nor Flash (64Mb) PSRAM (128Mb) RESET_N ADCs VDD_EXT USB (U)SIMs SPI I2Cs PCM UARTs STATUS WLAN LCD Keypads SD Card Figure 1: Functional Diagram 2.4.
LTE Standard Module Series 3 Application Interfaces 3.1. General Description EC200U series is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces.
LTE Standard Module Series 3.2. Pin Assignment The following figure shows the pin assignment of EC200U series module.
LTE Standard Module Series 3.3. Pin Description The following tables show the pin definition of EC200U series module. Table 6: I/O Parameters Definition Type Description AI Analog Input AO Analog Output AIO Analog Input/Output DI Digital Input DO Digital Output DIO Digital Input/Output OD Open Drain PI Power Input PO Power Output Table 7: Pin Description Power Supply Pin Name VBAT_BB Pin No.
LTE Standard Module Series 7 PO Provide 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA Power supply for external GPIO’s pull-up circuits. Add 2.2 μF capacitor if used. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI Turn on/off the module VILmax = 0.5 V VBAT power domain VDD_EXT Turn on/off RESET_N 20 DI Reset the module VILmax = 0.5 V VBAT power domain. If unused, keep it open. Active low. Pin No.
LTE Standard Module Series unused, keep it open. (U)SIM Interface Pin Name USIM_GND Pin No. I/O 10 Description DC Characteristics Comment Connect to the GND of (U)SIM card connector. (U)SIM1 card GND IOmax = 50 mA USIM_VDD 14 PO (U)SIM1 card power supply For 1.8 V (U)SIM: Vmax = 1.9 V Vmin = 1.7 V For 3.0 V (U)SIM: Vmax = 3.05 V Vmin = 2.7 V Either 1.8 V or 3.0 V can be recognized by the module automatically. For 1.8 V (U)SIM: VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.
LTE Standard Module Series hot-plug detect VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V If unused, keep it open. IOmax = 50 mA USIM2_VDD 128 PO (U)SIM2 card power supply For 1.8 V (U)SIM: Vmax = 1.9 V Vmin = 1.7 V For 3.0 V (U)SIM: Vmax = 3.05 V Vmin = 2.7 V Either 1.8 V or 3.0 V can be recognized by the module automatically. For 1.8 V (U)SIM: VILmax = 0.6 V VIHmin = 1.26 V VOLmax = 0.45 V VOHmin = 1.35 V AP_READY 2 DIO (U)SIM card data For 3.0 V (U)SIM: VILmax = 1.0 V VIHmin = 1.
LTE Standard Module Series MAIN_RI 62 DO Main UART ring indication VOLmax = 0.45 V VOHmin = 1.35 V MAIN_DCD 63 DO Main UART data carrier detect VOLmax = 0.45 V VOHmin = 1.35 V MAIN_CTS MAIN_RTS 64 65 DO DI 1.8 V power domain. If unused, keep it open. DTE clear to send signal from DCE VOLmax = 0.45 V VOHmin = 1.35 V Connect to DTE’s CTS. 1.8 V power domain. If unused, keep it open. DTE request to send signal to DCE VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.
LTE Standard Module Series VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. 138 DO Auxiliary UART transmit Pin Name Pin No. I/O Description DC Characteristics Comment ADC2 43 AI General-purpose ADC interface Voltage range: 0–VBAT_BB ADC1 44 AI General-purpose ADC interface Voltage range: 0–VBAT_BB ADC0 45 AI General-purpose ADC interface Voltage range: 0–VBAT_BB Use 1 kΩ resistor in series. If unused, keep it open.
LTE Standard Module Series PCM_DIN 24 DI PCM data input PCM_DOUT 25 DO PCM data output VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V PCM_SYNC 26 DI PCM data frame sync PCM_CLK 27 DI PCM clock Pin Name Pin No. I/O Description DC Characteristics SPI_CS 37 DO SPI chip select VOLmax = 0.45 V VOHmin = 1.
LTE Standard Module Series Backlight adjustment Configurable current current sink method, and connected to the backlight cathode, the brightness can be adjusted with current control. Description DC Characteristics Comment Matrix Keyboard Interface Pin Name USB_BOOT Pin No. 115 I/O DI Matrix key input0 It can be multiplexed as KEYIN0 after startup. 1.8 V power domain. If unused, keep it open. The KEYIN1 cannot be pulled up before startup.
LTE Standard Module Series SDIO1_CMD 33 DIO SDIO command SDIO1_VDD 34 PO SDIO power supply Pin Name Pin No. I/O Description WLAN_SLP_ CLK 118 DO WLAN sleep clock DO WLAN power supply enable control VOLmax = 0.45 V VOHmin = 1.35 V WLAN SDIO data bit 3 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V WLAN SDIO data bit 2 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.
LTE Standard Module Series VIHmax = 2.0 V WLAN_EN 136 DO WLAN function enable control VOLmax = 0.45 V VOHmin = 1.35 V I/O Description DC Characteristics Antenna Interface Pin Name ANT_BT/WIFI_ SCAN Pin No. 35 AIO Comment The shared antenna interface of Bluetooth and Wi-Fi Scan Bluetooth and Wi-Fi Scan cannot be used simultaneously; Wi-Fi Scan antenna can only receive but not transmit. 50 Ω characteristic impedance. If unused, keep it open.
LTE Standard Module Series VIHmin = 1.26 V VIHmax = 2.0 V SLEEP_IND W_DISABLE# 3 4 DO Sleep indicator Airplane control DI GPIO1 126 DO CP log BT_EN 139 GRFC1 143 DIO Generic RF controller GRFC2 144 DIO Generic RF controller mode open. VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V 1.8 V power domain. Pull-up by default. Driving the pin low can make the module enter the airplane mode.
LTE Standard Module Series Minimum Functionality Mode AT+CFUN=0 can set the module to a minimum functionality mode without removing the power supply. In this case, RF function will be invalid. Airplane Mode AT+CFUN=4 or W_DISABLE# can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level.
LTE Standard Module Series ⚫ ⚫ Driving MAIN_DTR to low level by the host can wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 3.22 for details about MAIN_RI behavior. 3.5.1.2. USB Application with USB Remote Wakeup Function* If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to make the module enter sleep mode. ⚫ ⚫ ⚫ Execute AT+QSCLK=1 to enable sleep mode.
LTE Standard Module Series In this case, three preconditions can make the module enter the sleep mode. ⚫ ⚫ ⚫ Execute AT+QSCLK=1 to enable sleep mode. Ensure the MAIN_DTR is held at high level, or keep it open. Ensure the host’s USB bus, which is connected with the module’s USB interface, enters suspended state. The following figure shows the connection between the module and the host.
LTE Standard Module Series Module Host GPIO USB_VBUS Power Switch VDD USB_DP USB_DP USB_DM USB_DM MAIN_RI EINT AP_READY GPIO GND GND Figure 6: Sleep Mode Application without Suspended Function The module will be wakened up when USB_VBUS is restored to be powered. NOTE Please pay attention to the level match shown in dotted line between the module and the host. 3.5.2.
LTE Standard Module Series 3.6. Power Supply 3.6.1. Power Supply Pins The module provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. ⚫ ⚫ Two VBAT_RF pins for module’s RF part. Two VBAT_BB pins for module’s baseband part and RF part. Table 9: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 Power supply for module’s RF part 3.3 3.8 4.
LTE Standard Module Series To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB and VBAT_RF.
LTE Standard Module Series MIC29302WU DC_IN VBAT 470 μF ADJ 5 3 1 51K OUT GND IN EN 2 4 100K 1% 470R 4.7K 100 nF VBAT_EN 470 μF 100 nF 47K 1% 47K Figure 9: Reference Circuit of Power Supply 3.6.4. Monitor the Power Supply You can use AT+CBC to monitor the VBAT_BB voltage value. For more details, see document [2]. 3.7. Turn on/Turn off/Reset 3.7.1. Turn on Module with PWRKEY Table 10: Pin Description of PWRKEY Pin Name Pin No.
LTE Standard Module Series PWRKEY ≥ 2 s 4.7K 10 nF Turn-on pulse 47K Figure 10: Turn on Module by Using Driving Circuit Another way to control the PWRKEY is to use a button directly. When pressing the button, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure.
LTE Standard Module Series NOTE1 VBAT PWRKEY ≥2s VIL ≤ 0.5 V About 1.15 s VDD_EXT RESET_N ≥ 5.05 s STATUS (DO) ≥4s UART Inactive Active ≥ 2.23 s USB Inactive Active Figure 12: Power-up Timing NOTE 1. 2. Please make sure that VBAT is stable before PWRKEY is pulled down. It is recommended that the time interval between powering up VBAT and pulling down PWRKEY is no less than 30 ms.
LTE Standard Module Series 3.7.2.1. Turn off Module with PWRKEY Driving PWRKEY low for at least 3 s and releasing it, the module executes power-down procedure. The power-down scenario is illustrated in the following figure. VBAT ≥ 3 s ≥ 30 s PWRKEY STATUS (DO) Module Status Running Power-down procedure OFF Figure 13: Power-down Timing 3.7.2.2.
LTE Standard Module Series 3.7.3. Reset the Module The RESET_N can be used to reset the module. The module can be reset by driving RESET_N low for at least 100 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 11: Pin Description of RESET_N Pin Name Pin No.
LTE Standard Module Series The timing of resetting module is illustrated in the following figure. VBAT ≥ 100 ms RESET_N VIL ≤ 0.5 V Module Status Running Baseband resetting Baseband restart Figure 16: Timing of Resetting Module NOTE 1. 2. Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N. It is recommended to use RESET_N only when the module cannot be turned off by AT+QPOWD or PWRKEY. 3.8.
LTE Standard Module Series USIM_DET 13 USIM_GND 10 DI 1.8 V power domain. If unused, keep it open. (U)SIM card hot-plug detect (U)SIM card GND Table 13: Pin Definition of (U)SIM2 Interface Pin Name Pin No. I/O Description Comment USIM2_VDD 128 PO (U)SIM2 card power supply AP_READY 2 DIO (U)SIM2 card data WAKEUP_IN 1 DO (U)SIM2 card clock W_DISABLE# 4 DO (U)SIM2 card reset SLEEP_IND 3 DI (U)SIM2 card hot-plug detect The (U)SIM2 function is optional.
LTE Standard Module Series USIM_VDD 10 K 100 nF USIM_GND Module USIM_VDD USIM_RST USIM_CLK USIM_DATA (U)SIM Card Connector VCC RST CLK 0R GND VPP IO 0R 0R 33 pF 33 pF 33 pF GND GND Figure 18: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in your applications, please follow the criteria below in (U)SIM circuit design: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Place (U)SIM card connector as close to the module as possible.
LTE Standard Module Series interface only supports USB slave mode and it can be used for AT command communication, data transmission, software debugging and firmware upgrade. Table 14: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_DP 69 AIO USB differential data bus (+) Require differential impedance of 90 Ω USB_DM 70 AIO USB differential data bus (-) Require differential impedance of 90 Ω USB_VBUS 71 AI USB connection detect Typical 5.0 V, Minimum 3.
LTE Standard Module Series extra stubs of trace must be as short as possible. The following principles should be complied with when designing the USB interface, so as to meet USB 2.0 specification. ⚫ ⚫ ⚫ Route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 Ω. Do not route signal traces under crystals, oscillators, magnetic device and RF signal traces.
LTE Standard Module Series MAIN_TXD 67 DO Main UART transmit MAIN_RXD 68 DI Main UART receive Table 16: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD 12 DO Debug UART transmit DBG_RXD 11 DI Debug UART receive 1.8 V power domain. If unused, keep them open. Table 17: Pin Definition of Auxiliary UART Interface Pin Name Pin No. I/O Description Comment AUX_TXD 138 DO Auxiliary UART transmit AUX_RXD 137 DI Auxiliary UART receive 1.
LTE Standard Module Series 4.7K VDD_EXT VDD_EXT 1 nF MCU/ARM Module 10K MAIN_RXD TXD RXD MAIN_TXD 1 nF 10K VCC_MCU VDD_EXT 4.7K RTS CTS GPIO EINT GPIO GND MAIN_RTS MAIN_CTS MAIN_DTR MAIN_RI MAIN_DCD GND Figure 21: Reference Circuit with Transistor Circuit NOTE 1. 2. Triode level transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. 3.11.
LTE Standard Module Series SPI_MOSI 38 DO SPI master mode output SPI_MISO 39 DI SPI master mode input SPI_CLK 40 DO SPI clock that supports GNSS function, the SPI function of Pin 37–40 cannot be used and needs to be left unconnected. 3.12. I2C Interfaces The module provides two I2C interfaces. Table 19: Pin Definition of I2C Interfaces Pin Name Pin No.
LTE Standard Module Series 1.8 V power domain. If unused, keep it open. PCM_DOUT 25 DO PCM data output PCM_SYNC 26 DI PCM data frame sync PCM_CLK 27 DI PCM clock 1.8 V power domain. If unused, keep it open. The PCM function only supports slave mode.
LTE Standard Module Series output (+) LOUDSPK_N 74 AO Loudspeaker differential output (-) MIC_P 75 AI Microphone analog input (+) MIC_N 77 AI Microphone analog input (-) AIN ⚫ ⚫ AIN channel is a differential input channel, which can be applied for input of microphone (usually an electret microphone). The AOUT channel is a differential output with a built-in power amplifier. The default configuration of power amplifier is Class AB and the maximum driving power is 500 mW for 8 Ω load.
LTE Standard Module Series Close to Microphone Close to Module GND 10 pF 0603 33 pF 0603 GND Differential layout GND 10 pF 0603 33 pF 0603 10 pF 0603 33 pF 0603 10 pF 0603 33 pF 0603 MIC_P Module 10 pF 0603 MIC_N 10 pF 0603 33 pF 0603 33 pF 0603 GND GND ESD Electret Microphone GND GND ESD GND Figure 23: Reference Circuit of Microphone Interface NOTE MIC channel is sensitive to ESD, so it is not recommended to remove the ESD components used for protecting the MIC. 3.14.3.
LTE Standard Module Series 3.15. LCD Interface The LCD interface of the module supports a liquid crystal display with a maximum resolution of 320 × 240 and DMA transmission, 16-bit RGB565 and YUV formats. Table 22: Pin Definition of LCD Interface Pin Name Pin No.
LTE Standard Module Series it can be used as KEYIN0 after startup. 1.8 V power domain. If unused, keep it open. The KEYIN1 78 DI Matrix keyboard input1 KEYIN2 79 DI Matrix keyboard input2 KEYIN3 80 DI Matrix keyboard input3 KEYOUT0 83 DO Matrix keyboard output0 KEYOUT1 84 DO Matrix keyboard output1 KEYOUT2 113 DO Matrix keyboard output2 KEYOUT3 114 DO Matrix keyboard output3 KEYIN1 cannot be pulled up before startup. 1.8 V power domain. If unused, keep them open. 3.17.
LTE Standard Module Series Module VDD_3V SDIO1_VDD SDIO1_DATA3 SDIO1_DATA2 SDIO1_DATA1 SDIO1_DATA0 SDIO1_CLK SDIO1_CMD SD_DET + R7 NM R1 0R R8 NM R9 NM R10 NM R11 NM SD Card Connector VDD C10 100 μF C9 100 nF C8 33 pF C7 10 pF CD/DAT3 R2 0R DAT2 R3 0R DAT1 R4 0R DAT0 R5 0R CLK R6 0R CMD C1 NM D1 C2 NM D2 C3 NM D3 C4 NM D4 C5 NM D5 D7 C6 NM D6 DETECTIVE VSS Figure 25: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication pe
LTE Standard Module Series Table 25: Pin Definition of WLAN Interface Pin Name Pin No. I/O Description Comment WLAN_SLP_CLK 118 DO WLAN sleep clock If unused, keep it open.
LTE Standard Module Series 3.19. ADC Interfaces The module provides three ADC interfaces. AT+QADC=0 can be used to read the voltage value on ADC0 pin. AT+QADC=1 can be used to read the voltage value on ADC1 pin. AT+QADC=2 can be used to read the voltage value on ADC2 pin. For more details about AT+QADC, please refer to document [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded with ground. Table 26: Pin Definition of ADC Interfaces Pin Name Pin No.
LTE Standard Module Series Table 28: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment NET_MODE 5 DO Indicate the module's network activity status NET_STATUS 6 DO Indicate the module's network registration mode 1.8 V power domain. If unused, keep them open.
LTE Standard Module Series 3.21. STATUS The STATUS pin is an output for module’s operation status indication. When the module is turned on normally, the STATUS outputs high level. Table 30: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 DO Indicate the module's operation status 1.8 V power domain. If unused, keep it open. A reference circuit is shown in the following figure. Module VBAT 2.2K STATUS 4.
LTE Standard Module Series NOTE The AT+QURCCFG allows you to set the main UART, USB AT port or USB modem port as the URC output port. The USB AT port is used to send AT commands by default. In addition, MAIN_RI behaviors can be configured flexibly. The default behaviors of the MAIN_RI are shown as below.
LTE Standard Module Series MODULE MODULE S1 KEYOUT0 VDD_EXT Test points 2 1 4.7K USB_BOOT USB_BOOT 3 GND TVS TVS Close to test points TVS Close to test points Figure 28: Reference Circuit of USB_BOOT Interface NOTE Please make sure that VBAT is stable before PWRKEY is pulled down. It is recommended that the time interval between powering up VBAT and pulling down PWRKEY is no less than 30 ms.
LTE Standard Module Series 4 Antenna Interfaces EC200U series module provides a main antenna interface, a Wi-Fi Scan/Bluetooth antenna interface and a GNSS antenna interface. The antenna ports have an impedance of 50 Ω. 4.1. Main Antenna and Wi-Fi Scan/Bluetooth Antenna Interfaces 4.1.1. Pin Definition The pin definition of main antenna and Wi-Fi Scan/Bluetooth antenna interfaces is shown below. Table 33: Pin Definition of Antenna Interfaces Pin Name Pin No.
LTE Standard Module Series 4.1.2.
LTE Standard Module Series LTE-FDD B5 824–849 869–894 MHz LTE-FDD B7 2500–2570 2620–2690 MHz LTE-FDD B8 880–915 925–960 MHz LTE-FDD B20 832–862 791–821 MHz LTE-FDD B28 703–748 758–803 MHz LTE-TDD B38 2570–2620 2570–2620 MHz LTE-TDD B40 2300–2400 2300–2400 MHz LTE-TDD B41 2496–2690 2496–2690 MHz Table 36: EC200U-AU Operating Frequencies 3GPP Band Transmit Receive Unit GSM850 824–849 869–894 MHz EGSM900 880–915 925–960 MHz DCS1800 1710–1785 1805–1880 MHz PCS190
LTE Standard Module Series 4.1.3. Reference Design of RF Antenna Interfaces A reference design of ANT_MAIN and ANT_BT/WIFI_SCAN is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Main antenna Module R1 0R ANT_MAIN C1 C2 NM NM Wi-Fi Scan/ Bluetooth antenna R2 ANT_BT/WIFI _SCAN 0R C3 C4 NM NM Figure 29: Reference Circuit of RF Antenna Interfaces NOTE 1. 2.
LTE Standard Module Series ANT_GNSS 47 AI 50 Ω impedance. If unused, keep it open. GNSS antenna interface Table 38: GNSS Frequency Type Frequency Unit GPS 1575.42 ±1.023 MHz GLONASS 1597.5–1605.8 MHz Galileo 1575.42 ±2.046 MHz BeiDou (Compass) 1561.098 ±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below: VDD 0.1 uF 10R Module GNSS Antenna 47 nH 100 pF 0R ANT_GNSS NM NM Figure 30: Reference Circuit of GNSS Antenna NOTE 1.
LTE Standard Module Series 4.3. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance.
LTE Standard Module Series Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
LTE Standard Module Series For more details about RF layout, please refer to document [3]. 4.4. Antenna Installation 4.4.1. Antenna Requirement The following table shows the requirements of main antenna. Table 39: Antenna Requirements Type Requirements GNSS Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (typ.) Passive antenna gain: > 0 dBi Active antenna noise factor: < 1.
LTE Standard Module Series Figure 35: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 36: Mechanicals of U.
LTE Standard Module Series The following figure describes the space factor of mated connector. Figure 37: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.
LTE Standard Module Series 5 Electrical Characteristics, Radio and Reliability 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 40: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 6.0 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB - 1.5 A Peak Current of VBAT_RF - 2.0 A Voltage at Digital Pins -0.3 2.
LTE Standard Module Series 5.2. Power Supply Ratings Table 41: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum value. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.0/3.0 A USB_VBUS USB detection 5.0 5.
LTE Standard Module Series Table 42: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit +25 +75 ºC Operating Temperature Range 10 -35 Extended Temperature Range 11 -40 +85 ºC -40 +90 ºC Storage Temperature Range 5.4. Power Consumption Table 43: EC200U-CN Current Consumption Description Conditions Typ. Unit OFF state Power down 31 μA AT+CFUN=0 (USB disconnected) 1.126 mA EGSM900 @ DRX = 2 (USB disconnected) 3.271 mA EGSM900 @ DRX = 5 (USB disconnected) 2.
LTE Standard Module Series LTE-FDD @ PF = 64 (USB suspend) 3.152 mA LTE-FDD @ PF = 128 (USB disconnected) 1.487 mA LTE-FDD @ PF = 256 (USB disconnected) 1.314 mA LTE-TDD @ PF = 32 (USB disconnected) 2.581 mA LTE-TDD @ PF = 64 (USB disconnected) 1.868 mA LTE-TDD @ PF = 64 (USB suspend) 3.217 mA LTE-TDD @ PF = 128 (USB disconnected) 1.510 mA LTE-TDD @ PF = 256 (USB disconnected) 1.329 mA EGSM900 @ DRX = 5 (USB disconnected) 21.10 mA EGSM900 @ DRX = 5 (USB connected) 29.
LTE Standard Module Series LTE-FDD B8 @ 23.1 dBm 545.5 mA LTE-TDD B34 @ 23.01 dBm 287.1 mA LTE-TDD B38 @ 23.1 dBm 343.9 mA LTE-TDD B39 @ 22.95 dBm 294.6 mA LTE-TDD B40 @ 23.12 dBm 306.4 mA LTE-TDD B41 @ 23.37 dBm 393.3 mA EGSM900 PCL = 5 @ 33.27 dBm 250 mA EGSM900 PCL = 12 @ 19.42 dBm 92.2 mA EGSM900 PCL = 19 @ 6.21 dBm 62.8 mA DCS1800 PCL = 0 @ 30.24 dBm 175 mA DCS1800 PCL = 7 @ 16.2 dBm 75.4 mA DCS1800 PCL = 15 @ 0.87 dBm 57.
LTE Standard Module Series DCS1800 @ DRX = 5 (USB disconnected) 1.551 mA DCS1800 @ DRX = 5 (USB suspend) 2.778 mA DCS1800 @ DRX = 9 (USB disconnected) 1.381 mA LTE-FDD @ PF = 32 (USB disconnected) 2.535 mA LTE-FDD @ PF = 64 (USB disconnected) 1.848 mA LTE-FDD @ PF = 64 (USB suspend) 3.099 mA LTE-FDD @ PF = 128 (USB disconnected) 1.490 mA LTE-FDD @ PF = 256 (USB disconnected) 1.311 mA LTE-TDD @ PF = 32 (USB disconnected) 2.584 mA LTE-TDD @ PF = 64 (USB disconnected) 1.
LTE Standard Module Series EGSM900 1DL/4UL @ 28.3 dBm 406.9 mA DCS1800 4DL/1UL @ 30.1 dBm 156 mA DCS1800 3DL/2UL @ 28.5 dBm 213.7 mA DCS1800 2DL/3UL @ 26.4 dBm 244.9 mA DCS1800 1DL/4UL @ 25.1 dBm 252 mA PCS1900 4DL/1UL @ 29.93 dBm 153 mA PCS1900 3DL/2UL @ 27.99 dBm 219 mA PCS1900 2DL/3UL @ 25.94 dBm 249 mA PCS1900 1DL/4UL @ 23.87 dBm 261 mA LTE-FDD B1 @ 23.4 dBm 607 mA LTE-FDD B3 @ 22.96 dBm 508 mA LTE-FDD B5 @ 23 dBm 492 mA LTE-FDD B7 @ 22.
LTE Standard Module Series DCS1800 PCL = 0 @ 30.24 dBm 175 mA DCS1800 PCL = 7 @ 16.2 dBm 75.4 mA DCS1800 PCL = 15 @ 0.87 dBm 57.7 mA PCS1900 PCL = 0 @ 29.8 dBm 168 mA PCS1900 PCL = 7 @ 16.6 dBm 78 mA PCS1900 PCL = 15 @ 0.8 dBm 59 mA Table 45: EC200U-AU Current Consumption Description Conditions Typ.
LTE Standard Module Series LTE-TDD @ PF = 64 (USB disconnected) TBD mA LTE-TDD @ PF = 64 (USB suspend) TBD mA LTE-TDD @ PF = 128 (USB disconnected) TBD mA EGSM900 @ DRX = 5 (USB disconnected) TBD mA EGSM900 @ DRX = 5 (USB connected) TBD mA LTE-FDD @ PF = 64 (USB disconnected) TBD mA LTE-FDD @ PF = 64 (USB connected) TBD mA LTE-TDD @ PF = 64 (USB disconnected) TBD mA LTE-TDD @ PF = 64 (USB connected) TBD mA GSM850 4DL/1UL @ 32.89 dBm TBD mA GSM850 3DL/2UL @ 30.
LTE Standard Module Series LTE-FDD B1 @ 23.4 dBm TBD mA LTE-FDD B2 @ 23.4 dBm TBD mA LTE-FDD B3 @ 22.96 dBm TBD mA LTE-FDD B4 @ 22.96 dBm TBD mA LTE-FDD B5 @ 23 dBm TBD mA LTE-FDD B7 @ 22.8dBm TBD mA LTE-FDD B8 @ 23.1 dBm TBD mA LTE-FDD B28 @ 23.3 dBm TBD mA LTE-FDD B66 @ 23.3 dBm TBD mA LTE-TDD B38 @ 23.1 dBm TBD mA LTE-TDD B40 @ 23.12 dBm TBD mA LTE-TDD B41 @ 23.37 dBm TBD mA GSM850 PCL = 5 @ 33 dBm TBD mA GSM850 PCL = 12 @ 19.8 dBm TBD mA GSM850 PCL = 19 @ 6.
LTE Standard Module Series 5.5. Tx Power The following table shows the RF output power of EC200U series module. Table 46: EC200U-CN RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power EGSM900 33 dBm ±2 dB 5 dBm ±5 dB DCS1800 30 dBm ±2 dB 0 dBm ±5 dB LTE-FDD B1/B3/B5/B8 23 dBm ±2 dB < -39 dBm LTE-TDD B34/B38/B39/B40/B41 23 dBm ±2 dB < -39 dBm NOTE The GSM network access technology of EC200U-CN is optional.
LTE Standard Module Series EGSM900 33 dBm ±2 dB 5 dBm ±5 dB DCS1800 30 dBm ±2 dB 0 dBm ±5 dB PCS1900 30 dBm ±2 dB 0 dBm ±5 dB LTE-FDD B1/B2/B3/B4/B5/B7/B8/B28/B66 23 dBm ±2 dB < -39 dBm LTE-TDD B38/B40/B41 23 dBm ±2 dB < -39 dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 6 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 5.6.
LTE Standard Module Series LTE-TDD B40 (10 MHz) -99.4 dBm -96.3 dBm LTE-TDD B41 (10 MHz) -98.9 dBm -94.3 dBm NOTE The GSM network access technology of EC200U-CN is optional. If the module that you select doesn’t support GSM network access technology, there is no corresponding RF receiving sensitivity data. Table 50: EC200U-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency 3GPP Primary GSM850 -109.5 dBm -102.0 dBm EGSM900 -109.5 dBm -102.
LTE Standard Module Series Table 51: EC200U-AU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency 3GPP Primary GSM850 TBD -102.0 dBm EGSM900 TBD -102.0 dBm DCS1800 TBD -102.0 dBm PCS1900 TBD -102.0 dBm LTE-FDD B1 (10 MHz) TBD -96.3 dBm LTE-FDD B2 (10 MHz) TBD -94.3 dBm LTE-FDD B3 (10 MHz) TBD -93.3 dBm LTE-FDD B4 (10 MHz) TBD -96.3 dBm LTE-FDD B5 (10 MHz) TBD -94.3 dBm LTE-FDD B7 (10 MHz) TBD -94.3 dBm LTE-FDD B8 (10 MHz) TBD -93.
LTE Standard Module Series Table 52: Electrostatics Discharge Characteristics (25 ºC, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±5 ±10 kV Antenna Interfaces ±4 ±8 kV Other Interfaces ±0.
LTE Standard Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter. The tolerances for dimensions without tolerance values are ±0.2 mm. 6.1.
LTE Standard Module Series Pin 1 Figure 39: Module Bottom Dimensions NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.
LTE Standard Module Series 6.2. Recommended Footprint Pin 1 Figure 40: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.
LTE Standard Module Series 6.3. Top and Bottom Views Figure 41: Top & Bottom View of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
LTE Standard Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. Storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
LTE Standard Module Series Table 53: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max. slope 1 to 3 °C/sec Soak time (between A and B: 150 °C and 200 °C) 70 to 120 sec Reflow Zone Max. slope 2 to 3 °C/sec Reflow time (D: over 217 °C) 40 to 70 sec Max. temperature 235 °C to 246 °C Cooling down slope -1.5 to -3 °C/s Reflow Cycle Max. reflow cycle 1 NOTE 1. 2. 3. 4.
LTE Standard Module Series 7.3.1. Carrier Tape Dimension details are as follow: Figure 43: Carrier Tape Dimension Drawing Table 54: Carrier Tape Dimension Table (Unit: mm) W P T A0 B0 K0 K1 F E 44 40 0.4 31.5 28.5 3.0 5.6 20.2 1.75 7.3.2.
LTE Standard Module Series Table 55: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 W 330 100 44.5 7.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 250 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, then vacuumize it.
LTE Standard Module Series 8 Appendix References Table 56: Related Documents Document Name [1] Quectel_UMTS<E_EVB_User_Guide [2] Quectel_EC200U&EG915U_Series_AT_Commands_Manual [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_SMT_User_Guide Table 57: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR Adaptive Multi-Rate bps Bits Per Second CHAP Challenge Handshake Authentication Protocol CMUX Connection Multiplexing CS Coding Scheme CTS Clear t
LTE Standard Module Series DTR Data Terminal Ready EFR Enhanced Full Rate EGSM Enhanced GSM EMI Electromagnetic Interference ESD Electrostatic Discharge ESR Equivalent Series Resistance EVB Evaluation Board FDD Frequency Division Duplex FR Full Rate FTP File Transfer Protocol FTPS FTP-over-SSL GND Ground GSM Global System for Mobile Communications HR Half Rate HTTP Hypertext Transfer Protocol HTTPS Hypertext Transfer Protocol Secure LED Light Emitting Diode LTE Long Term
LTE Standard Module Series PAP Password Authentication Protocol PCB Printed Circuit Board PDA Personal Digital Assistant PDU Protocol Data Unit PF Paging Frame POS Point of Sale PPP Point-to-Point Protocol RF Radio Frequency RGB Red, Green, Blue SM Smart Media SMS Short Message Service SMTP Simple Mail Transfer Protocol SSL Secure Sockets Layer TCP Transmission Control Protocol TDD Time Division Duplexing UART Universal Asynchronous Receiver &Transmitter UDP User Datagram P
LTE Standard Module Series VIHmin Minimum High-level Input Voltage VILmax Maximum Low-level Input Voltage VILmin Minimum Low-level Input Voltage VOHmax Maximum High-level Output Voltage VOHmin Minimum High-level Output Voltage VOLmax Maximum Low-level Output Voltage VOLmin Minimum Low-level Output Voltage VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network EC200U_Series_Hardware_Design 95 / 95
