User Manual

SC20-A_Manual_R1.0 Confidential / Released 42 / 57
Figure 8: Recommended Stencil Design for LGA Pads
Time
50
100
150 200
250 300
50
100
150
200
250
160 ºC
200 ºC
217
0
70s~120s
40s~60s
Between 1~3 ºC/s
Preheat Heating Cooling
ºC
s
Liquids Temperature
Temperature
Figure 9: Reflow Soldering Thermal Profile
1.5mm
1.5mm
0.55mm
0.55mm