SC200L-EM Hardware Design Smart module series Rev:1.0 Date: 2020-9-21 Status：Controlled Documents www.quectel.
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SC200L Hardware Design About the Document Revision History Revision Date Author Description 1.
SC200L Hardware Design Contents About the Document ................................................................................................................................ 3 Contents .................................................................................................................................................... 4 1 Introduction ....................................................................................................................................... 6 1.1.
SC200L Hardware Design 4 Wi-Fi and BT................................................................................................................................... 55 4.1. Wi-Fi Overview ....................................................................................................................... 55 4.1.1 Wi-Fi Performance ....................................................................................................... 55 4.2 BT Overview ................................................
SC200L Hardware Design 1 Introduction This document defines the SC200L module and its air interfaces and hardware interfaces which are connected with customers’ application. 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating SC200L module.
SC200L Hardware Design The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals.
SC200L Hardware Design 2 Product Concept 2.1. General Description SC200L is a series of 4G Smart LTE module based on UNISOC platform and Android operating system, and provides industrial grade performance. Its general features are listed below: Support LTE-FDD, LTE-TDD, WCDMA, EDGE, GSM and GPRS coverage. Support short-range wireless communication via Wi-Fi 802.11a/b/g/n and BT4.2 LE. Integrate GPS/GLONASS/BeiDou satellite positioning systems. Support multiple audio and video codecs.
SC200L Hardware Design 2.2. Evaluation Board To help customers design and test applications with Quectel SC200L modules, Quectel supplies an evaluation kit, which includes an evaluation board, a USB to RS232 converter cable, a USB T data cable, a power adapter, an earphone and antennas.
SC200L Hardware Design 3 Application Interfaces 3.1. General Description SC200L is an SMD type module with 146 LCC pins and 128 LGA pins. The following chapters provide the detailed description of pins/interfaces listed below.
SC200L Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of SC200Lmodule.
SC200L Hardware Design 3.3. Pin Description The following tables show the SC200L’s pin definition. Table 4: I/O Parameters Definition Type Description AI Analog input AO Analog output DI Digital input DO Digital output IO Bidirectional OD Open drain PI Power input PO Power output The following tables show the SC200L’s pin definition and electrical characteristics. Table 5: Pin Description Power supply Pin Name VBAT_BB VBAT_RF LDO1_1V85 Pin No.
SC200L Hardware Design Power supply for sensors, cameras, and I2C pull-up circuits. LDO2_1V8 125 PO 1.8V output power supply Vnorm = 1.80 V IOmax = 500 mA LDO4_2V8 156 PO 2.80V output power supply Vnorm = 2.80 V IOmax = 200 mA Power supply for LCD, touch screen and sensors 输出 2.80 V Vnorm = 2.80 V IOmax = 150 mA Power supply for camera AVDD and AFVDD。 LDO3_2V8 129 PO GND Pin Name Pin No.
SC200L Hardware Design HPH_L 138 AO Headphone left channel output HS_DET 139 AI Headset insertion detection HPMIC_DET 150 AI Headphone microphone detection MIC_BIAS1 147 PO Microphone bias1 voltage AI Microphone input for secondary microphone (+) MIC3_P 152 The default is high. VO = 2.20~3.00 V Vnorm = 2.50 V MIC3_N 151 AI Microphone input for secondary microphone (-) MIC_BIAS2 149 PO Microphone bias2 voltage VO = 2.20~3.00 V Vnorm = 2.80 V Pin Name Pin No.
SC200L Hardware Design USIM2_RST USIM2_CLK USIM2_DATA USIM2_VDD USIM1_DET USIM1_RST USIM1_CLK 18 19 20 21 22 23 24 SC200L_Hardware_Design DO DO IO PO DI DO DO (U)SIM2 card reset signal VOLmax = 0.1 × USIM2_VDD VOHmin = 0.9 × USIM2_VDD It cannot be multiplexed into a Generic GPIOs. (U)SIM2 card clock signal VOLmax = 0.1 × USIM2_VDD VOHmin = 0.9 × USIM2_VDD It cannot be multiplexed into a Generic GPIOs. (U)SIM2 card data signal VILmax = 0.3 × USIM2_VDD VIHmin = 0.
SC200L Hardware Design USIM1_DATA 25 IO (U)SIM1 card data signal VILmax = 0.3 × USIM1_VDD VIHmin = 0.7 × USIM1_VDD VOLmax = 0.1 × USIM1_VDD VOHmin = 0.9 × USIM1_VDD 1.80 V (U)SIM: Vmax = 1.85 V Vmin = 1.75 V 26 PO (U)SIM1 card power supply Pin Name Pin No. I/O Description DC Characteristics UART0_TXD 34 DO UART0 transmit data VOLmax = 0.20 V VOHmin = 1.46 V UART0_RXD 35 DI UART0 receive data VILmax = 0.48 V VIHmin = 1.39 V UART0_CTS 36 DI UART0 clear to send VILmax = 0.
SC200L Hardware Design Command signal of SD card 1.8 V SD card： VILmax = 0.53 V VIHmin = 1.30 V VOLmax = 0.19 V VOHmin = 1.58 V 3.0 V SD card： VILmax = 0.87 V VIHmin = 2.17 V VOLmax = 0.31 V VOHmin = 2.61 V High speed bidirectional digital signal lines of SD card 1.8 V SD card： VILmax = 0.53 V VIHmin = 1.30 V VOLmax = 0.19 V VOHmin = 1.58 V 3.0 V SD card： VILmax = 0.87 V VIHmin = 2.17 V VOLmax = 0.31 V VOHmin = 2.61 V DI SD card insertion detection VILmax = 0.48 V VIHmin = 1.
SC200L Hardware Design PWM LCD_RST 29 49 Adjust the backlight brightness. PWM control signal. VOLmax = 0.20 V VOHmin = 1.46 V 1.85V power domain. Can be used as ordinary GPIO. DO LCD reset signal VOLmax = 0.20 V VOHmin = 1.46 V 1.85V power domain. Can be used as ordinary GPIO. VILmax = 0.48 V VIHmin = 1.39 V 1.85V power domain. Can be used as ordinary GPIO.
SC200L Hardware Design CSI1_LN1_P 68 AI CAMERA MIPI data 1 signal (+) CSI0_CLK_N 70 AI CAMERA MIPI clock signal (-) CSI0_CLK_P 71 AI CAMERA MIPI clock signal (+) CSI0_LN0_N 72 AI CAMERA MIPI data 0 signal (-) CSI0_LN0_P 73 AI CAMERA MIPI data 0 signal (+) MCAM_MCLK 74 DO Clock signal of camera VOLmax = 0.20 V VOHmin = 1.46 V SCAM_MCLK 75 DO Clock signal of camera VOLmax = 0.20 V VOHmin = 1.46 V MCAM_RST 79 DO Reset signal of camera VOLmax = 0.20 V VOHmin = 1.
SC200L Hardware Design RGB LED light interface RGB_B RGB_R RGB_G 249 252 253 LED control negative Connect to the negative pole of LED, the maximum current is 27.7 mA. LED control negative Connect to the negative pole of LED, the maximum current is 27.7 mA. AI LED control negative Connect to the negative pole of LED, the maximum current is 27.7 mA. AI AI SENSOR_I2C Interfaces Pin Name Pin No.
SC200L Hardware Design CS_P 184 AI Fuel gauge detection positive Connect the fuel gauge to ground when not in use. BAT_THERM 134 AI Battery temperature detection 10 kΩ NTC is supported by default, and a 10 kΩ NTC resistor must be connected to ground. If it is not used, an external 10 kΩ resistor must be connected to the ground. BAT_ID 185 AI Battery type detection Input range: 0~1.2 V, floating if not used 。 Pin Name Pin No.
SC200L Hardware Design GPIO_134 102 IO GPIO GPIO_11 103 IO GPIO GPIO_10 104 IO GPIO GPIO_138 105 IO GPIO GPIO_121 106 IO GPIO GPIO_52 107 IO GPIO GPIO_53 108 IO GPIO GPIO_54 109 IO GPIO GPIO_55 110 IO GPIO GPIO_122 112 IO GPIO GPIO_33 113 IO GPIO GPIO_130 115 IO GPIO Can be reused as EXTINT13 GPIO_93 116 IO GPIO Can be reused as EXTINT8 GPIO_90 117 IO GPIO Can be reused as EXTINT5 GPIO_92 118 IO GPIO Can be reused as EXTINT7 GPIO_91 119 IO
SC200L Hardware Design Pin Name USB_BOOT VIB_DRV_P Pin No. 46 28 I/O DI PO DC Characteristics Comment Force the module to enter emergency download mode VILmax = 0.48 V VIHmin = 1.39 V Pull down USB_BOOT to GND will force the module enter emergency download mode. Motor drive VO = 1.80~3.30 V IOmax = 100 mA Connected to the positive terminal of the motor. Description Reserved Interfaces Pin Name Pin No.
SC200L Hardware Design Figure 2: Voltage Drop Sample To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used, and a multi-layer ceramic chip capacitor (MLCC) should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array and place these capacitors close to VBAT_BB/RF pins.
SC200L Hardware Design 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of SC200L should be able to provide sufficient current up to 3A at least. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply power for the module.
SC200L Hardware Design 3.5. Turn on and off Scenarios 3.5.1. Turn on Module Using the PWRKEY The module can be turned on by driving the PWRKEY pin to a low level for at least 2.5s. PWRKEY pin is pulled to VBAT internally. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. R3 PWRKEY 1K >2.5 s R1 Turn on pulse Q1 4.
SC200L Hardware Design The turning on the scenario is illustrated in the following figure. Figure 7: Timing of Turning on Module NOTES 1. 2. When the module is powered on for the first time, its timing of turning on may be different from that shown above. Make sure that VBAT is stable before pulling down the PWRKEY pin. The recommended time between them is no less than 30ms. PWRKEY pin cannot be pulled down all the time.
SC200L Hardware Design 3.5.2. Turn off Module Set the PWRKEY pin low for at least 1s, and then choose to turn off the module when the prompt window comes up. It can also be forced to restart by pulling down the PWRKEY key for a long time (more than 7 seconds). The restart sequence diagram is as follows: Figure 8: Restart timing diagram 3.6. Power Output SC200L supports the output of regulated voltages for peripheral circuits.
SC200L Hardware Design 3.7. Battery Charge and Management SC200L module can recharge batteries. The battery charger in the SC200L module supports trickle charging, constant current charging and constant voltage charging modes. Trickle charging: There are two steps in this mode. When the battery voltage is between 1.1V and 2.05V, a 70mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.05V and 3.
SC200L Hardware Design A reference design for the battery charging circuit is shown below. Figure 9: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones and handheld POS systems are powered by batteries. When different batteries are utilized, the charging and discharging curve has to be modified correspondingly so as to achieve the best effect.
SC200L Hardware Design Table 8: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment Vmax = 9.20 V Vmin = 4.50 V Vnorm = 5.00 V USB_VBUS 141、142 PI USB power supply USB_DM 13 AI/AO USB 2.0 differential data bus (-) USB_DP 14 AI/AO USB differential data bus (+) USB_ID 16 DI USB ID detection of the input USB 2.0 standard compliant. 90Ω differential impedance. For USB 2.
PGND 2 AGND 3 PGND 9 SC200L Hardware Design Figure 11: USB OTG Interface Reference Design In order to ensure USB performance, please comply with the following principles while designing a USB interface. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω. Keep the ESD protection devices as close as possible to the USB connector.
SC200L Hardware Design 3.9. UART Interfaces SC200L provides two UART interfaces: UART0: 4-wire UART interface, hardware flow control supported. UART1（DEBUG）: 2-wire UART interface; used for debugging by default.
SC200L Hardware Design following figure shows the reference design. Figure 13: RS-232 Level Match Circuit (for UART0) NOTE Please note that the CTS and RTS pins of the serial port hardware flow control are directly connected, and pay attention to the input and output directions. 3.10. (U)SIM Interface SC200L provides 2 (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Card Dual Standby is supported by default. Both 1.8V and 2.
SC200L Hardware Design USIM2_VDD 21 PO (U)SIM2 card power supply Either 1.8V or 2.95V (U)SIM card is supported. USIM1_DET 22 DI (U)SIM1 card plug detection Active Low. If it is not used, keep it open.Enabled by default via software.It can be multiplexed into a generic GPIO. USIM1_RST 23 DO (U)SIM1 card reset signal It cannot be multiplexed into a generic GPIO. USIM1_CLK 24 DO (U)SIM1 card clock signal It cannot be multiplexed into a generic GPIO.
SC200L Hardware Design Figure 15: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to ensure good performance and avoid damage of (U)SIM cards, please follow the criteria listed below during (U)SIM circuit design: Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length of (U)SIM card signals as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces.
SC200L Hardware Design SD_CLK 39 DO High-speed digital clock signal of SD card SD_CMD 40 IO Command signal of SD card SD_DATA0 41 IO 50Ω characteristic impedance High-speed bidirectional digital signal lines of SD card SD_DATA1 42 IO SD_DATA2 43 IO SD_DATA3 44 IO SD_DET 45 DI SD card insertion detection Active low SD_VDD 38 PO 3V output power supply Power supply for SD card A reference circuit for the SD card interface is shown below.
SC200L Hardware Design recommended to route the trace on the inner layer of PCB and keep the same trace length for CLK, CMD, DATA0, DATA1, DATA2 and DATA3. CLK needs separate ground shielding. Layout guidelines: Control impedance to 50Ω ±10% and ground shielding is required. The total trace length difference between CLK and other signal line traces like CMD and DATA should not exceed 1 mm. Table 13: SD Card Trace Length Inside the Module Pin No. Signal Length (mm) 39 SD_CLK 43.50 40 SD_CMD 42.
SC200L Hardware Design GPIO_135 101 GPIO_135 IN/PU GPIO_134 102 GPIO_134 IN/PD GPIO_11 103 GPIO_11 IN/PD GPIO_10 104 GPIO_10 IN/PD GPIO_138 105 GPIO_138 IN/PU GPIO_121 106 GPIO_121 OUT/L GPIO_52 107 GPIO_52 IN/PU GPIO_53 108 GPIO_53 IN/PD GPIO_54 109 GPIO_54 IN/PD GPIO_55 110 GPIO_55 IN/PD GPIO_122 112 GPIO_122 IN/PD GPIO_33 113 GPIO_33 IN/PD GPIO_130 115 GPIO_130 IN/PD Can be reused as EXTINT13 GPIO_93 116 GPIO_93 IN/PD Can be reused as EXTINT8 GPI
SC200L Hardware Design 4. 5. For the EN pin of flash, switch charging, DC/DC and other chips, please select the PD's GPIO control by default. When ordinary GPIO is used as an input interrupt, edge wakeup is not supported when the system sleeps, only level wakeup is supported. 3.13. I2C Interfaces SC200L module provides four I2C interfaces. As an open-drain signal, the I2C interfaces need a pull-up resistor on its external circuit, and the recommended power domain is 1.85V.
SC200L Hardware Design Table 16: Pin Definition of SPI Interfaces Pin Name Pin No I/O Description Comment GPIO_52 107 DO SPI2 chip select signal Multiplexed as SPI2_CSN GPIO_53 108 DO SPI2 data output Multiplexed as SPI2_DO GPIO_54 109 DI SPI2 data input Multiplexed as SPI2_DI GPIO_55 110 DO SPI2 clock signal Multiplexed as SPI2_CLK GPIO_93 116 DO SPI0 clock signal Multiplexed as SPI0_CLK GPIO_90 117 DO SPI0 chip select signal Multiplexed as SPI0_CSN GPIO_92 118 DI SPI
SC200L Hardware Design 3.16. LCM Interface SC200L provides an LCM interface, which is MIPI_DSI standard compliant. The interface supports high-speed differential data transmission and supports HD+ display (1440x720 @60fps). The pin definition of the LCM interface is shown below. Table 18: Pin Definition of LCM Interface Pin Name Pin No I/O Description Comment Vnorm = 1.80 V IOmax = 500 mA LDO2_1V8 125 PO 1.
SC200L Hardware Design A reference circuit for the LCM interface is shown below. Figure 17: Reference Circuit Design for LCM Interface MIPI is high-speed signal lines. It is recommended that common-mode filters should be added in series near the LCM connector, so as to improve protection against electromagnetic radiation interference. It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required.
SC200L Hardware Design Figure 18: Reference Design for External Backlight Driving Circuit 3.17. Touch Panel Interface SC200L provides one I2C interface for connection with Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The definitions of TP interface pins are illustrated below. Table 19: Pin Definition of Touch Panel Interface Pin Name Pin No I/O Description Comment LDO4_2V8 156 PO 2.80V output power supply for TP VDD Vnorm = 2.
SC200L Hardware Design Figure 19: Reference Circuit Design for TP Interface NOTE The touch screen uses LDO4_2V8 power supply by default (normally open). LDO4_2V8 can output 200 mA current。 3.18. Camera Interface Based on the standard MIPI CSI video input interface, the SC200L module supports two cameras (2-lane + 1-lane), Front-camera 1-lane MIPI, can support up to 2 MP photography; rear-camera 2-lane MIPI, can support up to 8 MP photography.
SC200L Hardware Design CSI1_LN0_P 66 AI CAMERA MIPI data0 signal (+) CSI1_LN1_N 67 AI CAMERA MIPI data1 signal (-) CSI1_LN1_P 68 AI CAMERA MIPI data1 signal (+) CSI0_CLK_N 70 AI CAMERA MIPI clock signal (-) CSI0_CLK_P 71 AI CAMERA MIPI clock signal (+) CSI0_LN0_N 72 AI CAMERA MIPI data0 signal (-) CSI0_LN0_P 73 AI CAMERA MIPI data0 signal (+) MCAM_MCLK 74 DO Clock signal of camera SCAM_MCLK 75 DO Clock signal of camera MCAM_RST 79 DO Reset signal of camera MCAM_PWDN
SC200L Hardware Design Front camera connector Rear camera connector 4.7μF 4.7μF 1 μF 1 μF Figure 20: Reference Circuit Design for Cameras NOTE CSI1 is used for the rear camera, and CSI0 is used for the front camera.
SC200L Hardware Design Special attention should be paid to the pin definition of LCM/camera connectors. Assure the SC200L and the connectors are correctly connected . MIPI is high speed signal lines, supporting maximum data rate up to 1.5Gbps. The differential impedance should be controlled to 100Ω. Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces.
SC200L Hardware Design 67 CSI1_LN1_N 17.46 0.37 68 CSI1_LN1_P 17.83 70 CSI0_CLK_N 18.24 71 CSI0_CLK_P 17.80 72 CSI0_LN0_N 18.64 -0.44 0.15 73 CSI0_LN0_P 18.79 3.19. Sensor Interfaces SC200L module supports communication with sensors via I2C interfaces, and it supports ALS/PS, compass, G-sensor, and gyroscopic sensors.
SC200L Hardware Design 3.20. Audio Interface SC200L module provides three analog input channels and three analog output channels. The following table shows the pin definition.
SC200L Hardware Design maximum output current is 2mA. The earpiece interface uses differential output. The loudspeaker interface uses the differential output as well. The output channel is available with a Class-D amplifier whose output power is 0.8W when load is 8Ω. The headphone interface features stereo left and right channel output, and headphone insert detection function is supported. 3.20.
SC200L Hardware Design 3.20.2 Handset interface reference circuit C2 33 pF R1 EAR_P C1 0R 100 pF R2 EAR_N 0R C3 GND D1 D2 33 pF Module Figure 23: Earpiece output interface reference circuit 3.20.
SC200L Hardware Design 3.20.4 Speaker interface reference circuit Figure 25: Speaker interface reference circuit 3.20.5 Audio signal design considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10pF and 33pF) for filtering out RF interference, thus reducing TDD noise. The 33pF capacitor is applied for filtering out RF interference when the module is transmitting at EGSM900. Without placing this capacitor, TDD noise could be heard.
SC200L Hardware Design 3.21. Emergency Download Interface USB_BOOT is an emergency download interface. Pull the pin to ground during power-up will force the module to enter emergency download mode.There is an emergency option when failures such as abnormal start-up or running occur. For the convenient firmware upgrade and debugging in the future, please reverse this pin. The reference circuit design is shown below.
SC200L Hardware Design 4 Wi-Fi and BT SC200L provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth (BT) functions. The interface impedance is 50Ω. External antennas such as PCB antenna, sucker antenna, and ceramic antenna can be connected to the module via the interface, so as to achieve Wi-Fi and BT functions. 4.1. Wi-Fi Overview SC200L supports 2.4GHz band WLAN wireless communication based on IEEE 802.11 b/g/n standard protocols. The maximum data rate is up to 72.2Mbps.
SC200L Hardware Design Table 3: Wi-Fi Receiving Performance Standard Rate Sensitivity 802.11b 1 Mbps -89 802.11b 11 Mbps -85 802.11g 6 Mbps -89 802.11g 54 Mbps -74 802.11n HT20 MCS0 -88 802.11n HT20 MCS7 -69 2.4 GHz Referenced specifications are listed below:： IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11b, IEEE Std 802.11d, IEEE Std 802.11e, IEEE Std 802.11g, IEEE Std 802.11i: IEEE 802.
SC200L Hardware Design 3.0+HS 24 Mbit/s Reference 3.0 + HS 4.0 24 Mbit/s Reference 4.0 LE Referenced specifications are listed below:： Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 4.2.
SC200L Hardware Design 5 GNSS SC200L integrates a Unisoc GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, and BeiDou. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1 GNSS Performance The following table lists the GNSS performance of the SC200L module in conduction mode. Table 29: GNSS Performance Parameter Sensitivity (GNSS) TTFF (GNSS) Static Drift (GNSS) Description Typ.
SC200L Hardware Design 5.2 GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GPS receiving sensitivity, longer GPS positioning time, or reduced positioning accuracy. In order to avoid this, please follow the reference design rules as below: 6 Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference.
SC200L Hardware Design 6 Antenna Interfaces SC200L provides four antenna interfaces for the main antenna, Rx-diversity/MIMO antenna, GNSS antenna and Wi-Fi/BT antenna, respectively. The antenna ports have an impedance of 50Ω. 6.1 Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. : Table30: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No.
SC200L Hardware Design LTE-FDD B8 925~960 880~915 MHz LTE-TDD B34 2010~2025 2010~2025 MHz LTE-TDD B38 2570~2620 2570~2620 MHz LTE-TDD B39 1880~1920 1880~1920 MHz LTE-TDD B40 2300~2400 2300~2400 MHz LTE-TDD B41 2535~2675 2535~2675 MHz Table32: SC200L-EM* Operating Frequencies 3GPP Band Receive Transmit Unit GSM850 869~894 824~849 MHz EGSM900 925~960 880~915 MHz DCS1800 1805~1880 1710~1785 MHz PCS1900 1930~1990 1850~1910 MHz WCDMA B1 2110~2170 1920~1980 MHz WCD
SC200L Hardware Design LTE-TDD B38 2570~2620 2570~2620 MHz LTE-TDD B39 1880~1920 1880~1920 MHz LTE-TDD B40 2300~2400 2300~2400 MHz LTE-TDD B41 2496~2690 2496~2690 MHz NOTE “*” means under development. 6.1.1 Main and Rx-diversity Antenna Interfaces Reference Design A reference circuit design for main and Rx-diversity antenna interfaces is shown as below. A π-type matching circuit should be reserved for better RF performance.
SC200L Hardware Design height from the reference ground to the signal layer (H), and the clearance between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip line or coplanar waveguide with different PCB structures.
SC200L Hardware Design Figure 29: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 30: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50Ω.
SC200L Hardware Design ANT_WIFI/BT 77 IO Wi-Fi/BT antenna interface 50Ω impedance Table 5: Wi-Fi/BT Frequency Type Frequency Unit Wi-Fi (2.4GHz) CE: 2412-2472 MHz FCC: 2412-2462 MHz MHz BT4.2 LE 2402~2480 MHz A reference circuit design for Wi-Fi/BT antenna interface is shown as below. C1 and C2 are not mounted and a 0Ω resistor is mounted on R1 by default. Figure28: Reference Circuit Design for Wi-Fi/BT Antenna 6.
SC200L Hardware Design GPS 1575.42 ±1.023 MHz GLONASS 1597.5~1605.8 MHz BeiDou 1561.098 ±2.046 MHz NOTE SC200L-WFnot support GNSS。 6.3.1 Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below.
SC200L Hardware Design Figure 30: Reference Circuit Design for GNSS Active Antenna 6.4 Antenna Installation 6.4.1 Antenna Requirements The following table shows the requirement on the main antenna, RX-diversity antenna, Wi-Fi/BT antenna and a GNSS antenna.
SC200L Hardware Design Polarization Type: Vertical Insertion Loss: < 1dB Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive Antenna Gain: > 0dBi Active Antenna Noise Figure: < 1.5dB Active Antenna Total Gain: < 17dBi (Typ.) GNSS 6.4.2 Recommended RF Connector for Antenna Installation If an RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 31: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.
SC200L Hardware Design Figure 32: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 33: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.
SC200L Hardware Design 6 Electrical, Reliability and Radio Characteristics 7.1 Absolute Maximum Ratings The following table lists the maximum withstand voltage/current of some pins of the module: Table 6: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT -0.3 6.0 V USB_VBUS -0.3 16.0 V Peak Current of VBAT 0 3.0 A Voltage on Digital Pins -0.3 1.98 V 7.2 Power Supply Ratings Table 7: SC200L Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max.
SC200L Hardware Design transmission slot) USB_VBUS 4.50 5.0 9.20 V 7.3 Operation and Storage Temperatures The operating temperature is listed in the following table. Table 8: Operation and Storage Temperatures Parameter Min. Operating temperature range 1) -30 Typ. Max. Unit +25 +75 ºC +90 ºC Storage Temperature Range -40 NOTE 1) Within the operation temperature range, the module is 3GPP compliant. 7.4 Current Consumption The values of current consumption are shown below.
SC200L Hardware Design current LTE-FDD supply current LTE-TDD supply current GSM Sleep (USB disconnected) @DRX=7 3.7 mA Sleep (USB disconnected) @DRX=8 3.5 mA Sleep (USB disconnected) @DRX=9 3 mA Sleep (USB disconnected) @DRX=5 6.5 mA Sleep (USB disconnected) @DRX=6 4.8 mA Sleep (USB disconnected) @DRX=7 4.2 mA Sleep (USB disconnected) @DRX=9 3.8 mA Sleep (USB disconnected) @DRX=5 6.2 mA Sleep (USB disconnected) @DRX=6 4.8 mA Sleep (USB disconnected) @DRX=7 4.
SC200L Hardware Design DCS1800 (3UL/2DL) @ PCL 0 305 mA DCS1800 (4UL/1DL) @ PCL 0 330 mA EGSM900 (1UL/4DL) @ PCL 8 325 mA EGSM900 (2UL/3DL) @ PCL 8 580 mA EGSM900 (3UL/2DL) @ PCL 8 860 mA EGSM900 (4UL/1DL) @ PCL 8 730 mA DCS1800 (1UL/4DL) @ PCL 2 230 mA DCS1800 (2UL/3DL) @ PCL 2 370 mA DCS1800 (3UL/2DL) @ PCL 2 435 mA DCS1800 (4UL/1DL) @ PCL 2 450 mA B1 (HSDPA) @ max power 620 mA B8 (HSDPA) @ max power 530 mA B1 (HSUPA) @ max power 520 mA B8 (HSUPA) @ max power 500
SC200L Hardware Design Table 10: SC200L-EM Current Consumption Paramete r Description Conditions Min Typ. IVBAT OFF state Power down 350 μA 7.5 RF Output Power The following table shows the RF output power of SC200L module. Table 41: SC200L-CE RF Output Power Frequency Max. Min.
SC200L Hardware Design Table 42: SC200L-EM RF Output Power Frequency Max. Min.
SC200L Hardware Design 2. “*” means under development. 7.6 RF Receiving Sensitivity The following table shows the RF receiving sensitivity of SC200L module. Table 44: SC200L-EM RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) GSM850 -108 / / -102.4 dBm EGSM900 -108 / / -102.4 dBm DCS1800 -108 / / -106.7 dBm PCS1900 -107 / / -103.7 dBm WCDMA B1 -108 -110 / -104 dBm WCDMA B2 -107.5 -109.5 / -108 dBm WCDMA B5 -111 -111.5 / -108 dBm WCDMA B8 -109.
SC200L Hardware Design LTE-TDD B40 (10 MHz) -97.4 -98.9 -100.9 -96.3 dBm LTE-TDD B41 (10 MHz) -96.2 -97.5 -100.2 -94.3 dBm NOTE “*” means under development. 7.7 Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be subject to ESD handling precautions that are typically applied to ESD sensitive components.
SC200L Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are ±0.05 mm. 8.
SC200L Hardware Design Pin 1 Figure 35: SC200L Module Bottom Dimensions (Top View) SC200L_Hardware_Design 79 / 103
SC200L Hardware Design 8.2 Recommended Footprint Figure36: Recommended Footprint (Top View) NOTES 1. For easy maintenance of the module, keep about 5 mm between the module and other components on the host PCB. 2. All RESERVED pins should be kept open and MUST NOT be connected to ground.
SC200L Hardware Design 8.3 Top and Bottom Views of the Module Figure37: Top View of the Module Figure 38: Bottom View of the Module NOTE These are renderings of SC200L module. For authentic dimension and appearance, please refer to the module that you receive from Quectel.
SC200L Hardware Design 8 Storage, Manufacturing and Packaging 8.1 Storage SC200L is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are shown as below. 1. Recommended storage conditions: temperature 23 ± 5 °C, and relative humidity 35% ~ 60%.储 2. Under the recommended storage conditions, the module can be stored in a vacuum sealed bag for 12 months. 3.
SC200L Hardware Design Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18 mm~0.20 mm. It is recommended to slightly reduce the amount of solder paste for LGA pads, thus avoiding short-circuit.
SC200L Hardware Design Max slope 2~3 °C/s Reflow time (D: over 220 °C) 45~70 s Max temperature 238 °C ~ 246 °C Cooling down slope -1.5 ~ -3 °C/s Reflow Cycle Max reflow cycle 1 9.3 Packaging SC200L is packaged in tape and reel carriers, and sealed in the vacuum-sealed bag. It is not recommended to open the vacuum package before using the module for actual production. Each reel is 380 mm in diameter and contains 200 modules. The following figures show the package details, measured in mm.
SC200L Hardware Design Figure 41: Reel Dimensions (Unit: mm) Table 13: Reel Packaging Model Name SC200L MOQ for MP 200 SC200L_Hardware_Design Minimum Package: 200pcs Minimum Package × 4=800pcs Size: 405 mm × 390 mm × 83 mm Size: 425 mm × 358 mm × 410 mm N.W: TBD G.W: TBD N.W: TBD G.
SC200L Hardware Design 9 Appendix A References Table 14: Related Documents SN Document Name Remark [1] Quectel_Smart_EVB_G2_User_Guide Smart EVB G2 user guide [2] Quectel_SC200L_Reference_Design SC200L reference design [3] Quectel_SC200L_GPIO_Configuration SC200L GPIO Configuration [4] Quectel_RF_Layout_Application_Note RF layout application note [5] Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide Table 15: Terms and Abbreviations Abbreviation Description ADC An
SC200L Hardware Design DSP Digital Signal Processor EDGE Enhanced Data Rate for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM ESD Electrostatic Discharge ESR Equivalent Series Resistance FDD Frequency Division Duplex FR Full Rate GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPIO General Purpose Input/Output GPRS General Packet Radio Service GPS Global Positioning System GPU Graphics Processing Unit GRFC Generic RF control GSM Global Syst
SC200L Hardware Design Inorm Normal Current LCC Leadless Chip Carrier LCD Liquid Crystal Display LCM LCD Module LDO Low Dropout Regulator LE Low Energy LED Light Emitting Diode LGA Land Grid Array LNA Low Noise Amplifier LTE Long-Term Evolution MIPI Mobile Industry Processor Interface NFC Near Field Communication NTC Negative Temperature Coefficient OTP One Time Programable PCB Printed Circuit Board PDU Protocol Data Unit PWM Pulse Width Modulation PSK Phase Shift Keying
SC200L Hardware Design SD Card Secure Digital Card SMS Short Message Service SPI Serial Peripheral Interface TDD Time-Division Duplex TP Touch Panel TVS Transient Voltage Suppressor Tx Transmit UART Universal Asynchronous Receiver & Transmitter UMTS Universal Mobile Teleco mmunications System USB Universal Serial Bus (U)SIM (Universal) Subscriber Identity Module VBAT Voltage at Battery (Pin) Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VI V
SC200L Hardware Design VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network SC200L_Hardware_Design 90 / 103
SC200L Hardware Design 10 Appendix B GPRS Coding Schemes Table 16: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl. USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 – Coded Bits 456 588 676 456 Punctured Bits 0 132 220 – Data Rate Kb/s 9.05 13.4 15.6 21.
SC200L Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
SC200L Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 SC200L_Hardware_Design 93 / 103
SC200L Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 18: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot MCS-1 GMSK C 8.80 kbps 17.60 kbps 35.20 kbps MCS-2 GMSK B 11.2 kbps 22.4 kbps 44.8 kbps MCS-3 GMSK A 14.8 kbps 29.6 kbps 59.2 kbps MCS-4 GMSK C 17.6 kbps 35.2 kbps 70.4 kbps MCS-5 8-PSK B 22.4 kbps 44.8 kbps 89.6 kbps MCS-6 8-PSK A 29.6 kbps 59.2 kbps 118.
SC200L Hardware Design FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
SC200L Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label.
SC200L Hardware Design (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
