Product Info

5G Module Series
RM502Q-GL Hardware Design
RM502Q-GL_Hardware_Design 13 / 77
1.
1)
HPUE is only for single carrier.
2.
2)
Within operation temperature range, the module meets 3GPP specifications.
3.
3)
Within extended temperature range, the module remains the ability to establish and maintain
functions such as voice, SMS, data transmission without any unrecoverable malfunction. Radio
spectrum and radio network will not be influenced, while one or more specifications, such as P
out
may
undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature
returns to the normal operating temperature level, the module will meet 3GPP specifications again.
4. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of RM502Q-GL.
Baseband
PMIC
Sub
-6 GHz
Transceiver
ANT0
ANT3
ANT2_GNSSL1
ET
VCC
RESET_N
38.4M
XO
SPMI
IQ
Control
Tx
PRx
DRx
PCI Express
M.2 Key
-B Interface
FULL_CARD_POWER_OFF#
W_DISABLE2#
USB 2.0 & USB 3.1
(U)SIM1
WWAN_LED#
WAKE_ON_WAN#
NAND Flash 4Gb x 8
LPDDR4 SDRAM 4Gb x 16
RFFE
W_DISABLE1#
GPIOs
Tx/Rx Blocks
ANT1
PCIe × 1
(U)SIM2
GND
Figure 1: Functional Diagram
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES