Product Info

5G Module Series
RM502Q-GL Hardware Design
RM502Q-GL_Hardware_Design 12 / 77
B1/B2/B3/B4/B7/B25/B30/B38/B39/B40/B41/B42/B43/B48/B66 LTE: Max 1.0
Gbps(DL)/200 Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA +, HSDPA, HSUPA and WCDMA
Support QPSK, 16QAM and 64QAM modulation
DC-HSDPA: Max 42 Mbps (DL)
HSUPA: Max 5.76 Mbps (UL)
WCDMA: Max 384 kbps (DL)/384 kbps (UL)
Internet Protocol
Features
Support QMI/NTP* protocols
Support the protocols PAP and EIRP usually used for PPP connections
SMS
Text and PDU modes
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interfaces
Support (U)SIM card: Class B (3.0 V) and Class C(1.8 V)
(U)SIM1 and (U)SIM2 interfaces
Support Dual SIM Single Standby*
USB Interface
Compliant with USB 3.1 and 2.0 specifications, with maximum
transmission rates up to 10 Gbps on USB 3.1 and 480 Mbps on USB 2.0.
Used for AT command communication, data transmission, firmware
upgrade, software debugging, GNSS NMEA sentence output and voice
over USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.65.4,
Android 4.x/5.x/6.x/7.x/8.x/9.x/10
PCIe × 1 Interface
Complaint with PCIe GEN3, support 8 Gbps per lane, PCIe × 1.
Used for AT command communication, data transmission, firmware upgrade,
software debugging, GNSS NMEA sentence output
Rx-diversity
Support 5G NR/LTE/WCDMA Rx-diversity
GNSS Features
Gen9 Lite of Qualcomm
Protocol: NMEA 0183
Data Update Rate: 1 Hz
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Antenna Interfaces
ANT0, ANT1, ANT2_GNSSL1, and ANT3
Physical
Characteristics
Size: (52.0 ±0.15) mm × (30.0 ±0.15) mm × (2.3 ±0.2) mm
Weight: approx. 8.6 g
Temperature Range
Operation temperature range: -30°C to +60°C
2)
Restricted Operation temperature range: -30°C to -2C, +60°C to +75°C
Extended temperature range: -40°C to -30°C, +75°C to +85°C
3)
Storage temperature range: -40°C to +90°C
Firmware Upgrade
USB 2.0 interface, PCIe interface and DFOTA